Semiconductor device

ABSTRACT

Disclosed is a semiconductor device including two oxide semiconductor layers, where one of the oxide semiconductor layers has an n-doped region while the other of the oxide semiconductor layers is substantially i-type. The semiconductor device includes the two oxide semiconductor layers sandwiched between a pair of oxide layers which have a common element included in any of the two oxide semiconductor layers. A double-well structure is formed in a region including the two oxide semiconductor layers and the pair of oxide layers, leading to the formation of a channel formation region in the n-doped region. This structure allows the channel formation region to be surrounded by an i-type oxide semiconductor, which contributes to the production of a semiconductor device that is capable of feeding enormous current.

BACKGROUND OF THE INVENTION

1. Field of the Invention

An embodiment of the present invention relates to a semiconductordevice, a light-emitting device, a power storage device, a drivingmethod thereof, or a manufacturing method thereof.

In this specification, a semiconductor device generally means a devicethat can function by utilizing semiconductor characteristics. Forexample, a semiconductor element such as a transistor; a power device;an integrated circuit, a power supply circuit, or a power supplyconverter circuit each including a power device; an electro-opticaldevice; a semiconductor circuit; and an electronic appliance may beincluded in a category of a semiconductor device or may include asemiconductor device.

2. Description of the Related Art

As a semiconductor device used for a power device, a power devicemanufactured with the use of silicon is widely prevalent. However, theperformance of a power device including silicon is reaching its limit,and it is becoming difficult to achieve higher performance.

In addition, silicon has a narrow band gap and thus there is a limit onthe temperature range of operation of power devices using silicon. Thus,in recent years, power devices including SiC or GaN, which has a wideband gap, have been developed.

Patent Documents 1 and 2 disclose the use of an oxide semiconductor fora semiconductor device that is used as a power device for high-powerapplication.

REFERENCE [Patent Document 1] Japanese Published Patent Application No.2011-91382 [Patent Document 2] Japanese Published Patent Application No.2011-172217 SUMMARY OF THE INVENTION

It is an object of one embodiment of the present invention to provide asemiconductor device including an oxide semiconductor that can beapplied to high power devices. An object of one embodiment of thepresent invention is to provide a semiconductor device capable offeeding a large current. A still further object of one embodiment of thepresent invention is to provide a highly reliable semiconductor device.

Note that the descriptions of these objects do not disturb the existenceof other objects. Note that one embodiment of the present invention doesnot necessarily achieve all the objects describe above. Other objectswill be apparent from and can be derived from the description of thespecification, the drawings, and the claims.

In accordance with one embodiment of the present invention, asemiconductor device having a large on-state current is achieved byusing an oxide semiconductor layer including an n-type region for a maincurrent path (a channel formation region). In addition, a pinch-offoperation is feasible by forming an oxide semiconductor layer includingan i-type region between the oxide semiconductor layer including ann-type region and a source electrode layer. Alternatively, asemiconductor device of one embodiment of the present invention includesa structure in which an i-type oxide semiconductor layer is formed tosurround an oxide semiconductor layer serving as a channel formationregion and having an n-type region in a cross-sectional view in thechannel length direction. Specifically, the structures described nextcan be employed for example.

One embodiment of the present invention is a semiconductor deviceincluding: a first oxide semiconductor layer including a first regioncontaining an impurity imparting n-type conductivity; a second oxidesemiconductor layer in contact with at least a part of the first region;a first oxide layer in contact with a lower surface of the first oxidesemiconductor layer; a second oxide layer in contact with an uppersurface of the second oxide semiconductor layer; a gate electrode layeroverlapping with the first region; a gate insulating layer between thefirst oxide semiconductor layer and the gate electrode layer; and asource electrode layer and a drain electrode layer electricallyconnected to the first oxide semiconductor layer, where: the first oxidelayer contains at least one of metal elements contained in the firstoxide semiconductor layer; the second oxide layer contains at least oneof metal elements contained in the second oxide semiconductor layer; andthe second oxide semiconductor layer covers a top surface and a sidesurface of the first oxide semiconductor layer.

One embodiment of the present invention is a semiconductor deviceincluding: a first oxide semiconductor layer including a first regioncontaining an impurity imparting n-type conductivity and a second regionincluding an i-type oxide semiconductor layer; a second oxidesemiconductor layer in contact with at least a part of the first region;a first oxide layer in contact with at least a part of the second regionand under the first oxide semiconductor layer; a second oxide layer incontact with an upper surface of the second oxide semiconductor layer; agate electrode layer overlapping with the first region; a gateinsulating layer between the first oxide semiconductor layer and thegate electrode layer; and a source electrode layer and a drain electrodelayer electrically connected to the first oxide semiconductor layer. Inthe semiconductor device, the first oxide layer contains at least one ofmetal elements contained in the first oxide semiconductor layer, thesecond oxide layer contains at least one of metal elements contained inthe second oxide semiconductor layer, and the second oxide semiconductorlayer covers a top surface and a side surface of the first oxidesemiconductor layer.

In the semiconductor divide, the source electrode layer and the drainelectrode layer may be in contact with and over the second oxide layer.Alternatively, the source electrode layer and the drain electrode layermay be in contact with and over the second oxide semiconductor layer,and the second oxide layer may be formed over the source electrode layerand the drain electrode layer.

Furthermore, in the semiconductor device, at least a part of the firstregion may be overlapped with the source electrode layer and the drainelectrode layer. Alternatively, one end portion of the first region maycoincide with one end portion of the source electrode layer and theother end portion of the first region may coincide with one end portionof the drain electrode layer in a cross section in a channel lengthdirection.

Moreover, in the semiconductor device, the gate electrode layer may havea region overlapping with the source electrode layer and may not have aregion overlapping with the drain electrode layer.

In accordance with one embodiment of the present invention, asemiconductor device which includes an oxide semiconductor and can beapplied to high-power devices can be provided. Alternatively, inaccordance with one embodiment of the present invention, a semiconductordevice that can feed a large current can be provided. Alternatively, inaccordance with one embodiment of the present invention, a semiconductordevice with high reliability can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A to 1C are a plan view and cross-sectional views illustratingone embodiment of a semiconductor device.

FIG. 2A is a diagram illustrating a stack structure included in asemiconductor device and FIG. 2B is a band diagram correspondingthereto.

FIGS. 3A to 3E are cross-sectional views illustrating an example of amethod for manufacturing a semiconductor device.

FIGS. 4A to 4D are cross-sectional views showing one example of a methodfor manufacturing a semiconductor device.

FIG. 5 is a cross-sectional view illustrating one embodiment of asemiconductor device.

FIGS. 6A to 6C are a plan view and cross-sectional views illustratingone embodiment of a semiconductor device.

FIGS. 7A to 7D are cross-sectional views illustrating an example of amethod for manufacturing a semiconductor device.

FIGS. 8A to 8D are a plan view and cross-sectional views illustratingone embodiment of a semiconductor device.

FIGS. 9A to 9D are a plan view and cross-sectional views illustratingone embodiment of a semiconductor device.

FIGS. 10A to 10D are cross-sectional views illustrating an example of amethod for manufacturing a semiconductor device.

FIGS. 11A to 11C are cross-sectional views illustrating an example of amethod for manufacturing a semiconductor device.

FIGS. 12A to 12D are a plan view and cross-sectional views illustratingone embodiment of a semiconductor device.

FIGS. 13A and 13B are nanobeam electron diffraction patterns of oxidesemiconductors in accordance with one embodiment.

FIGS. 14A and 14B are structural examples of power converter circuits inaccordance with one embodiment.

FIG. 15 is a structural example of a power converter circuit inaccordance with one embodiment.

FIG. 16 is a structural example of a power supply circuit in accordancewith one embodiment.

FIG. 17 is a structural example of a power supply circuit in accordancewith one embodiment.

FIGS. 18A to 18D each illustrate an electronic appliance in accordancewith one embodiment.

FIG. 19 is graphs each showing relationship the depth of a low-resistantregion and a band gap of the oxide semiconductor films with respect tothe acceleration voltage and the dose amount of phosphorus in Example.

FIG. 20 is a graph showing a band structure in Example.

DETAILED DESCRIPTION OF THE INVENTION

Embodiments of the present invention will be described below in detailwith reference to the drawings. Note that the present invention is notlimited to the following description, and it is easily understood bythose skilled in the art that modes and details of the present inventioncan be modified in various ways. Accordingly, the present inventionshould not be interpreted as being limited to the content of theembodiments below.

Note that in the structures of the present invention described below,the same portions or portions having similar functions are denoted bythe same reference numerals in different drawings, and description ofsuch portions is not repeated. Further, the same hatching pattern isapplied to portions having similar functions, and the portions are notespecially denoted by reference numerals in some cases.

Note that in each drawing described in this specification, the size, thefilm thickness, or the region of each component may be exaggerated forclarity. Therefore, embodiments of the present invention are not limitedto such a scale.

Note that the ordinal numbers such as “first” and “second” in thisspecification or the claims are used for convenience and do not indicatethe order of steps or the stacking order of layers. In addition, theordinal numbers do not denote particular names that specify the presentinvention.

Embodiment 1

In this embodiment, one embodiment of a semiconductor device and amethod for manufacturing the semiconductor device will be described withreference to FIGS. 1A to 1C, FIGS. 2A and 2B, FIGS. 3A to 3E, FIGS. 4Ato 4D, FIG. 5, FIGS. 6A to 6C, FIGS. 7A to 7D, and FIGS. 8A to 8D.

<Structural Example 1 of Semiconductor Device>

FIGS. 1A to 1C illustrate a structure example of a transistor 200. FIG.1A is a plan view of the transistor 200, FIG. 1B is a cross-sectionalview taken along the line V1-W1 in FIG. 1A, and FIG. 1C is across-sectional view taken along the line X1-Y1 in FIG. 1A.

The transistor 200 illustrated in FIGS. 1A to 1C includes a baseinsulating layer 102 formed over a substrate 100 having an insulatingsurface; a first oxide layer 104 over the base insulating layer 102; afirst oxide semiconductor layer 106 over the first oxide layer 104; asecond oxide semiconductor layer 108 covering a top surface and a sidesurface of the first oxide semiconductor layer 106; a second oxide layer110 over the second oxide semiconductor layer 108; a source electrodelayer 112 a and a drain electrode layer 112 b over the second oxidelayer 110; a gate insulating layer 114 over the second oxide layer 110;and a gate electrode layer 116 overlapping with the first oxidesemiconductor layer 106 with the gate insulating layer 114 interposedtherebetween. In addition, the transistor 200 may include an insulatinglayer 118 and an insulating layer 120 over the gate electrode layer 116as components. Furthermore, the transistor 200 may include an electrodelayer 122 a and an electrode layer 122 b electrically connected to thesource electrode layer 112 a and the drain electrode layer 112 b throughcontact holes formed in the gate insulating layer 114, the insulatinglayer 118, and the insulating layer 120.

The components of the transistor 200 will be described in detail below.

<Substrate>

The substrate 100 is not limited to a simple supporting member, and maybe a substrate where a device such as a transistor is provided. In thatcase, at least one of the gate electrode layer 116, the source electrodelayer 112 a, the drain electrode layer 112 b, the electrode layer 122 a,and the electrode layer 122 b of the transistor 200 may be electricallyconnected to the device provided to the substrate.

<Base Insulating Layer>

The base insulating layer 102 has a function of preventing diffusion ofimpurities from the substrate 100, and further a function of supplyingoxygen to the first oxide layer 104, the first oxide semiconductor layer106, the second oxide semiconductor layer 108, and/or the second oxidelayer 110. Therefore, an insulating layer containing oxygen is used forthe base insulating layer 102. Because oxygen is supplied from the baseinsulating layer 102, the oxygen vacancies in the first oxidesemiconductor layer 106 and the second oxide semiconductor layer 108 canbe reduced. Note that in the case where the substrate 100 is a substratewhere another device is provided, the base insulating layer 102 servesas an interlayer insulating film. In that case, the base insulatinglayer 102 is preferably subjected to planarization treatment such aschemical mechanical polishing (CMP) treatment so as to have a flatsurface.

In the transistor 200 in this embodiment, the base insulating layer 102containing oxygen is formed under a stacked structure including thefirst oxide semiconductor layer 106 where a channel formation region isformed. With such a structure, oxygen in the base insulating layer 102can be supplied to a channel formation region. The base insulating layer102 preferably has a region containing oxygen in excess of thestoichiometric composition. When the base insulating layer 102 containsoxygen in excess of the stoichiometric composition, supply of oxygen tothe channel formation region can be promoted.

Note that in this specification and the claims, the term “excess oxygen”means oxygen that can be transferred in an oxide semiconductor layer,silicon oxide, or silicon oxynitride by heat treatment or oxygen thatexists in excess of the intrinsic stoichiometric composition.

<First and Second Oxide Layers and First and Second Oxide SemiconductorLayers>

The transistor 200 includes a stacked structure where the first oxidelayer 104, the first oxide semiconductor layer 106, the second oxidesemiconductor layer 108, and the second oxide layer 110 are formedbetween the base insulating layer 102 and the gate insulating layer 114(hereinafter this structure is also referred to as an oxide stack 115).

The first oxide semiconductor layer 106 and the second oxidesemiconductor layer 108 preferably contain indium (In) or zinc (Zn).Alternatively, both In and Zn are preferably contained. In order toreduce the fluctuations in electrical characteristics of the transistorsincluding the oxide semiconductor layer, the oxide semiconductor layerpreferably contains a stabilizer in addition to indium and zinc.

As a stabilizer, gallium (Ga), tin (Sn), hafnium (Hf), aluminum (Al),zirconium (Zr), and the like can be given. As another stabilizer,lanthanoid such as lanthanum (La), cerium (Ce), praseodymium (Pr),neodymium (Nd), samarium (Sm), europium (Eu), gadolinium (Gd), terbium(Tb), dysprosium (Dy), holmium (Ho), erbium (Er), thulium (Tm),ytterbium (Yb), or lutetium (Lu) can be given.

Examples of the oxide semiconductor include indium oxide, tin oxide,zinc oxide, In—Zn oxide, Sn—Zn oxide, Al—Zn oxide, Zn—Mg oxide, Sn—Mgoxide, In—Mg oxide, In—Ga oxide, In—Ga—Zn oxide, In—Al—Zn oxide,In—Sn—Zn oxide, Sn—Ga—Zn oxide, Al—Ga—Zn oxide, Sn—Al—Zn oxide, In—Hf—Znoxide, In—La—Zn oxide, In—Ce—Zn oxide, In—Pr—Zn oxide, In—Nd—Zn oxide,In—Sm—Zn oxide, In—Eu—Zn oxide, In—Gd—Zn oxide, In—Tb—Zn oxide, In—Dy—Znoxide, In—Ho—Zn oxide, In—Er—Zn oxide, In—Tm—Zn oxide, In—Yb—Zn oxide,In—Lu—Zn oxide, In—Sn—Ga—Zn oxide, In—Hf—Ga—Zn oxide, In—Al—Ga—Zn oxide,an In—Sn—Al—Zn oxide, In—Sn—Hf—Zn oxide, and In—Hf—Al—Zn oxide.

Note that the first oxide semiconductor layer 106 and the second oxidesemiconductor layer 108 preferably have the same constituent elements,and further preferably, their compositions are identical. When thecompositions of the first oxide semiconductor layer 106 and the secondoxide semiconductor layer 108 are identical, the energies at the bottomof the conduction bands can be as close to each other as possible. As aresult, the current path is not limited to be formed in only one of thefirst oxide semiconductor layer 106 and the second oxide semiconductorlayer 108, and both of the layers can be used as a main current path. Asa result, the series resistance between the source and the drain of thetransistor can be reduced.

In this embodiment, as the first oxide semiconductor layer 106 and thesecond oxide semiconductor layer 108, oxide semiconductors representedby In-M-Zn oxides containing at least indium, zinc, and M (M is a metalof Al, Ga, Ge, Y, Zr, Sn, La, Ce, Hf, or the like) are used.

For the first oxide layer 104 in contact with the lower surface of thefirst oxide semiconductor layer 106, and the second oxide layer 110 incontact with the upper surface of the second oxide semiconductor layer108, oxide layers mainly containing an element other than an element(e.g., silicon) serving as an impurity in the oxide semiconductorlayers. For example, for the first oxide layer 104, an oxide layercontaining at least one of metal elements included in the first oxidesemiconductor layer 106 is used. In addition, for the second oxide layer110, an oxide layer containing at least one of metal elements includedin the second oxide semiconductor layer 108 is used.

As the first oxide layer 104, an oxide layer that is represented by anIn-M-Zn-based oxide (M is a metal such as Al, Ti, Ga, Ge, Y, Zr, Sn, La,Ce, or Hf) and contains a larger atomic ratio of M than that in thefirst oxide semiconductor layer 106 is used in this embodiment.Specifically, the atomic ratio of the element M in the first oxide layer104 is 1.5 times or more, preferably twice or more, more preferablythree times or more as much as that in the first oxide semiconductorlayer 106. The element M is more strongly bonded to oxygen than indiumis, and thus has a function of suppressing generation of an oxygenvacancy in the oxide layer. That is, an oxygen vacancy is more unlikelyto be generated in the first oxide layer 104 than in the first oxidesemiconductor layer 106. In addition, as the proportion of the element Mto indium or zinc is higher, the oxide has a larger energy gap. Thus,the first oxide layer 104 is an oxide layer having a larger band gapthan that of the first oxide semiconductor layer 106.

As the second oxide layer 110, an oxide layer that is represented by anIn-M-Zn-based oxide (M is a metal such as Al, Ti, Ga, Ge, Y, Zr, Sn, La,Ce, or Hf) and contains a larger atomic ratio of M than that in thesecond oxide semiconductor layer 108 is used. Specifically, the atomicratio of the element M in the second oxide layer 110 is 1.5 times ormore, preferably 2 times or more, more preferably 3 times or more asmuch as that in the second oxide semiconductor layer 108. Thus, anoxygen vacancy is more unlikely to be generated in the second oxidelayer 110 than in the second oxide semiconductor layer 108, and thesecond oxide layer 110 is an oxide layer having a larger band gap thanthat of the second oxide semiconductor layer 108. In the transistor 200,the second oxide layer 110 is an oxide layer located between the firstoxide semiconductor layer 106 serving as a channel formation region andthe source electrode layer 112 a and the drain electrode layer 112 b,and thus, the atomic ratio of M is preferably adjusted such that a bandgap allowing the second oxide layer 110 to exhibit semiconductorcharacteristics can be maintained. Note that the second oxide layer 110may serve as a part of the gate insulating layer depending on the atomicratio of M.

When each of the first oxide layer 104, the first oxide semiconductorlayer 106, the second oxide semiconductor layer 108, and the secondoxide layer 110 is an In-M-Zn oxide containing at least indium, zinc,and M (M is a metal element such as Al, Ti, Ga, Ge, Y, Zr, Sn, La, Ce,or Hf), and the first oxide layer 104 has an atomic ratio of In to M andZn which is x₁:y₁:z₁, the first oxide semiconductor layer 106 and thesecond oxide semiconductor layer 108 each have an atomic ratio of In toM and Zn which is x₂:y₂:z₂, and the second oxide layer 110 has an atomicratio of In to M and Zn which is x₃:y₃:z₃, each of y₁/x₁ and y₃/x₃ ispreferably larger than y₂/x₂. Each of y₁/x₁ and y₃/x₃ is one and a halftimes or more as large as y₂/x₂, preferably twice or more as large asy₂/x₂, more preferably three times or more as large as y₂/x₂. At thistime, when y₂ is greater than or equal to X₂ in the first oxidesemiconductor layer 106 and the second oxide semiconductor layer 108,the transistor can have stable electrical characteristics. However, wheny₂ is 3 times or more as large as x₂, the field-effect mobility of thetransistor is reduced; accordingly, y₂ is preferably less than 3 timesx₂.

In the case of using an In-M-Zn oxide for the first oxide layer 104,when Zn and oxygen are eliminated from consideration, the proportion ofIn and the proportion of M are preferably less than 50 atomic % andgreater than or equal to 50 atomic %, respectively, further preferablyless than 25 atomic % and greater than or equal to 75 atomic %,respectively. In the case of using In-M-Zn oxides for the first oxidesemiconductor layer 106 and second oxide semiconductor layer 108, whenZn and oxygen are eliminated from consideration, the proportion of Inand the proportion of M are preferably greater than or equal to 25atomic % and less than 75 atomic %, respectively, further preferablygreater than or equal to 34 atomic % and less than 66 atomic %,respectively. In the case of using an In-M-Zn oxide for the second oxidelayer 110, when Zn and oxygen are eliminated from consideration, theproportion of In and the proportion of M are preferably less than 50atomic % and greater than or equal to 50 atomic %, respectively, furtherpreferably less than 25 atomic % and greater than or equal to 75 atomic%, respectively.

The constituent elements of the first oxide layer 104 and the secondoxide layer 110 may be different from each other, or their constituentelements may be the same at the same atomic ratios or different atomicratios.

For the first oxide layer 104, the first oxide semiconductor layer 106,the second oxide semiconductor layer 108, and the second oxide layer110, for example, oxide semiconductors containing indium, zinc, andgallium can be used.

The thicknesses of the first oxide layer 104, the first oxidesemiconductor layer 106, the second oxide semiconductor layer 108, andthe second oxide layer 110 are preferably determined in accordance withelectric characteristics (such as output current) required for thetransistor 200. For example, the thickness of the second oxide layer 110ranges from 3 nm to 500 nm, preferably from 3 nm to 100 nm, furtherpreferably 3 nm to 50 nm. In addition, the thickness of each of thefirst oxide semiconductor layer 106 and the second oxide semiconductorlayer 108 ranges from 3 nm to 500 nm, preferably from 3 nm to 200 nm,further preferably 3 nm to 100 nm, still further preferably 3 nm to 50nm. In addition, the thickness of the first oxide layer 104 ispreferably larger than or equal to the thickness of the second oxidelayer 110, the first oxide semiconductor layer 106, or the second oxidesemiconductor layer 108.

Preferably, the first oxide layer 104 contains one or more kinds ofmetal elements constituting the first oxide semiconductor layer 106, andis formed using an oxide semiconductor whose energy of the bottom of theconduction band is closer to the vacuum level than that of the firstoxide semiconductor layer 106 by 0.05 eV or more, 0.07 eV or more, 0.1eV or more, or 0.15 eV or more and 2 eV or less, 1 eV or less, 0.5 eV orless, or 0.4 eV or less. Similarly, the second oxide layer 110 containsone or more kinds of metal elements constituting the second oxidesemiconductor layer 108, and is preferably formed using an oxidesemiconductor whose energy of the bottom of the conduction band is closeto the vacuum level than that of the second oxide semiconductor layer108 by 0.05 eV or more, 0.07 eV or more, 0.1 eV or more, or 0.15 eV ormore and 2 eV or less, 1 eV or less, 0.5 eV or less, or 0.4 eV or less.

Here, the first oxide semiconductor layer 106 includes a first region106 a containing an impurity imparting an n-type conductivity. In thetransistor 200, the first region 106 a is formed in the entire region ofthe upper surface of the first oxide semiconductor layer 106 so as tooverlap with the source electrode layer 112 a, the drain electrode layer112 b, and the gate electrode layer 116. In addition, a part of thesecond oxide semiconductor layer 108 is formed in contact with the firstregion 106 a.

Examples of the element imparting n-type conductivity contained in thefirst region 106 a include carbon (C), phosphorus (P), arsenic (As),antimony (Sb), boron (B), aluminum (Al), nitrogen (N), argon (Ar),helium (He), neon (Ne), indium (In), fluorine (F), chlorine (CO,hydrogen (H), titanium (Ti), and zinc (Zn) in this specification.

Although a case is specifically described where the first region 106 awith an increased conductivity is formed in the upper surface of thefirst oxide semiconductor layer 106, the first region 106 a may beformed throughout in the thickness direction of the first oxidesemiconductor layer 106 or an impurity imparting n-type conductivity maybe contained in a part of the first oxide layer 104. Note that a secondregion 106 b that is a region with a lower n-type impurity content,preferably a region containing an i-type or substantially i-type oxidesemiconductor is preferably included between the first region 106 a andthe first oxide layer 104, in the first oxide semiconductor layer 106.

In this structure, when an electric field is applied to the gateelectrode layer 116, a channel is formed in the first oxidesemiconductor layer 106 and the second oxide semiconductor layer 108(especially, in the first region 106 a of the first oxide semiconductorlayer 106) that have the lowest energies at the bottoms of theconduction bands in the stacked structure including the oxidesemiconductor layers. In other words, the second oxide layer 110 isformed between the first oxide semiconductor layer 106 including thefirst region 106 a and the gate insulating layer 114, whereby astructure in which the channel of the transistor 200 is not in contactwith the gate insulating layer 114 can be obtained.

In addition, the oxide layers in which oxygen vacancies are less likelyto be generated than in the first oxide semiconductor layer 106 areprovided over and under and in contact with the first oxidesemiconductor layer 106, whereby generation of oxygen vacancies in thechannel of the transistor can be suppressed.

When the first region 106 a containing the impurity imparting n-typeconductivity is provided in the first oxide semiconductor layer 106, theseries resistance between a source and a drain of the transistor 200 inan on state can be reduced. As a result, current flowing between thesource and the drain in the on state (the current is also referred to ason-state current) can be increased.

As illustrated in FIG. 1C, the source electrode layer 112 a and thefirst region 106 a are overlapped with each other, and thus carriers areeasily supplied to the first region 106 a from the source electrodelayer 112 a through the second oxide layer 110 and the second oxidesemiconductor layer 108, leading to an increase of on-state current.

To supply an impurity imparting n-type conductivity to the first oxidesemiconductor layer 106, an ion implantation method, an ion dopingmethod, a plasma immersion ion implantation method, or the like can beemployed.

In the first region 106 a, the concentration of the above element mayhave a continuous gradient in the thickness direction of the first oxidesemiconductor layer 106.

The second oxide semiconductor layer 108 is formed in such a way that itis in contact with the first region 106 a of the first oxidesemiconductor layer 106 and covers the top surface and the side surfacesof the first oxide semiconductor layer 106 (see FIG. 1B and FIG. 1C).The second oxide semiconductor layer 108 preferably includes an i-typeor substantially i-type oxide semiconductor. By forming the i-type orsubstantially i-type second oxide semiconductor layer 108 between thesource electrode layer 112 a and the first region 106 a, on or offoperations of the transistor 200 can be performed reliably. Furthermore,the transistor 200 can be normally off.

Here, the thickness of the second oxide semiconductor layer 108 ispreferably adjusted such that the distance between the source electrodelayer 112 a and the first region 106 a is large enough to preclude thecontact. For example, in a region overlapping with the source electrodelayer 112 a, the thickness of the second oxide semiconductor layer 108ranges from 10 nm to 40 nm, preferably from 20 nm to 40 nm, and thus theon or off operations of the transistor 200 can be performed reliablywithout on-state current loss. Furthermore, the transistor 200 can benormally off.

In addition, the second oxide semiconductor layer 108 is formed to coverthe side surfaces and the top surface of the first oxide semiconductorlayer 106, and thus the second oxide semiconductor layer 108 is locatedbetween the first region 106 a and the drain electrode layer 112 b, aswell as between the first region 106 a and the source electrode layer112 a. Because the first region 106 a is not in direct contact with thesource electrode layer 112 a and the drain electrode layer 112 b in thismanner, the on-state current of the transistor 200 can be increased atthe same time when the leakage current (also referred to as off-statecurrent) between the source and the drain in an off state of thetransistor 200 is decreased.

As illustrated in FIG. 1B, in the cross section in the channel widthdirection of the transistor 200, the side surfaces of the island-likefirst oxide semiconductor layer 106 is covered with the second oxidesemiconductor layer 108, and the side surfaces of the second oxidesemiconductor layer 108 is covered with the second oxide layer 110. Thisstructure can reduce the influence of a parasitic channel that might begenerated at the end portion in the channel width direction of the firstoxide semiconductor layer 106 and/or the second oxide semiconductorlayer 108. Therefore, the reliability of the transistor 200 can beimproved.

The oxide semiconductor layer (the first oxide semiconductor layer 106and the second oxide semiconductor layer 108) that contains oxygensufficiently and is highly purified has a band gap of about 2.8 eV to3.2 eV, has extremely few minority carriers having a density of about1×10⁻⁹/cm³. Majority carriers come only from a source of the transistor.Accordingly, in the transistor using the oxide semiconductor layer, anavalanche breakdown does not occur.

Therefore, even when driving is performed at a high voltage such asseveral tens volts or several hundred volts, it is possible to secure anextremely large channel width with respect to the channel length in thetransistor. As a result, the on-state current of the transistor can beincreased. For example, even when the ratio of the channel width to thechannel length (W/L) is greater than or equal to 10³, greater than orequal to 10⁴, or further, greater than or equal to 10⁵, favorable on/offoperation can be achieved. For example, in the case of driving at avoltage less than or equal to 30 V, when the channel length is 3 μm, thechannel width may fall within the range of 1 cm to 10 m, and forexample, may be 80 cm.

Further, since an oxide semiconductor has a large band gap, theelectrical characteristics of a transistor including an oxidesemiconductor can have extremely small temperature dependence. Forexample, it is possible to realize a transistor that has smalltemperature dependence of the threshold voltage, on-state current, oroff-state current as compared to a transistor using silicon as asemiconductor. Therefore, the transistor including an oxidesemiconductor is suitable for high temperature operation.

<Source Electrode Layer and Drain Electrode Layer>

For the source electrode layer 112 a and the drain electrode layer 112b, a conductive material that is easily bonded to oxygen can be usedpreferably. For example, Al, Cr, Cu, Ta, Ti, Mo, or W can be used. W(tungsten) having a high melting point is especially preferred because arelatively high process temperature can be employed in a later step.Note that a conductive material that easily reacts with oxygen includesa material where oxygen is easily diffused.

When such a conductive material that is easily bonded to oxygen is incontact with the oxide stack 115, oxygen in the oxide stack 115 isabstracted into the conductive material. There are some heating steps ina fabrication process of the transistor, and thus oxygen vacancies aregenerated in a region of the oxide stack 115 that is in the vicinity ofan interface between the oxide stack 115 and the source electrode layer112 a or the drain electrode layer 112 b, and thus an n-type region maybe formed. The n-type region can function as the source or the drain ofthe transistor 200.

Note that a constituent element of the source electrode layer 112 a andthe drain electrode layer 112 b may enter the n-type regions. Further, aregion having high oxygen concentration may be formed in part of thesource electrode layer 112 a and part of the drain electrode layer 112 bthat are in contact with the n-type regions. A constituent element ofthe oxide stack 115 may enter the source electrode layer 112 a and thedrain electrode layer 112 b in contact with the n-type regions in somecases.

In the above manner, the low-resistance region is formed in the regionof the oxide stack 115 in contact with the source electrode layer 112 aor the drain electrode layer 112 b, whereby contact resistance betweenthe oxide stack 115 and the source electrode layer 112 a or the drainelectrode layer 112 b is reduced, so that parasitic resistance betweenthe source and the drain in the transistor 200 can be reduced. As aresult, the on-state current of the transistor 200 can be increased.

In a case of forming a transistor with an extremely short channellength, the n-type region that is formed by the generation of the oxygenvacancies sometimes extends in the channel length direction of thetransistor. The extended n-type region in the channel length directioncan be a cause of failures in electric characteristics of the transistorsuch as a threshold voltage shift or uncontrollable on-off switching(conduction state) with a gate voltage. Accordingly, when a transistorwith an extremely short channel length is formed, it is preferable thatthe conductive material that is not easily bonded to oxygen be used forthe source electrode and the drain electrode. As the conductivematerial, for example, tantalum nitride, titanium nitride, or the likeis preferably used. Note that the conductive material that is not likelyto be bonded to oxygen includes, in its category, a material to whichoxygen is not easily diffused.

<Gate Insulating Layer>

The gate insulating layer 114 can be formed using a silicon oxide film,a gallium oxide film, an aluminum oxide film, a silicon nitride film, asilicon oxynitride film, an aluminum oxynitride film, a silicon nitrideoxide film, or the like. The gate insulating layer 114 is preferably afilm containing oxygen because it can supply oxygen to the second oxidelayer 110, the second oxide semiconductor layer 108 and/or the firstoxide semiconductor layer 106. In addition, as a material of the gateinsulating layer 114, hafnium oxide, yttrium oxide, hafnium silicate(HfSi_(x)O_(y) (x>0, y>0)), hafnium silicate to which nitrogen is added,hafnium aluminate (HfAl_(x)O_(y) (x>0, y>0)), or lanthanum oxide may beused. The gate insulating layer 114 may be formed with either asingle-layer structure or a stacked-layer structure.

<Gate Electrode Layer>

As a material of the gate electrode layer 116, a metal film containingan element selected from molybdenum, titanium, tantalum, tungsten,aluminum, copper, chromium, neodymium, and scandium; a metal nitridefilm containing any of the above elements as its component (a titaniumnitride film, a molybdenum nitride film, or a tungsten nitride film); orthe like can be used. Alternatively, a semiconductor film typified by apolycrystalline silicon film doped with an impurity element such asphosphorus, or a silicide film such as a nickel silicide film may beused as the gate electrode layer 116. Alternatively, a conductivematerial such as indium tin oxide, indium oxide containing tungstenoxide, indium zinc oxide containing tungsten oxide, indium oxidecontaining titanium oxide, indium tin oxide containing titanium oxide,indium zinc oxide, or indium tin oxide to which silicon oxide is addedcan also be used. Moreover, the gate electrode layer 116 can have astacked structure of the above conductive material and the above metalmaterial.

The gate electrode layer 116 can be formed to have a single-layerstructure or a stacked-layer structure. As one layer of the gateelectrode layer 116 that is in contact with the gate insulating layer114, a metal oxide containing nitrogen, specifically, an In—Ga—Zn—O filmcontaining nitrogen, an In—Sn—O film containing nitrogen, an In—Ga—Ofilm containing nitrogen, an In—Zn—O film containing nitrogen, a Sn—Ofilm containing nitrogen, an In—O film containing nitrogen, or a metalnitride (InN, SnN, or the like) film can be used. Such a film has a workfunction of higher than or equal to 5 eV, preferably higher than orequal to 5.5 eV, and the use of this film as the gate electrode layerenables the threshold voltage of the transistor to be shifted to apositive side. Accordingly, a normally-off switching element can beobtained.

<Band Structure of Stacked Layers in Transistor>

Band structures of the base insulating layer 102, the first oxide layer104, the first oxide semiconductor layer 106, the second oxidesemiconductor layer 108, the second oxide layer 110, and the gateinsulating layer 114 in the transistor 200 will be described withreference to FIGS. 2A and 2B.

FIG. 2A is a schematic view of a part of the stacked structure includingthe oxide stack 115, and FIG. 2B schematically illustrates a part of theenergy band structures of the stacked-layer structure in FIG. 2A.

In FIG. 2B, EcI1 schematically represents the energy of the bottom ofthe conduction band in the base insulating layer 102. Similarly, EcS1,EcS3, and EcI2 schematically represent the energies of the bottoms ofthe conduction bands in the first oxide layer 104, the second oxidelayer 110, and the gate insulating layer 114, respectively. In addition,EcS2 b represents the energies of the bottoms of the conduction bands ofthe second region 106 b in the first oxide semiconductor layer 106 andthe second oxide semiconductor layer 108, and EcS2 a represents theenergy of the bottom of the conduction band of the first region 106 a inthe first oxide semiconductor layer 106. EcS2 a is a lower energy thanEcS2 b. Note that the thickness of each layer in FIG. 2A is notconsidered for convenience.

Note that although FIG. 2B shows the case where the first oxide layer104 and the second oxide layer 110 are oxide layers having the sameenergy of the bottom of the conduction band, the first oxide layer 104and the second oxide layer 110 may be oxide layers which differ inenergy gap and energy of the bottom of the conduction band. Similarly,although the case where the first oxide semiconductor layer 106 and thesecond oxide semiconductor layer 108 are oxide semiconductor layershaving the same energy of the bottom of the conduction band, the firstoxide semiconductor layer 106 and the second oxide semiconductor layer108 may differ in energy gap and energy of the bottom of the conductionband.

Here, an energy difference between the vacuum level and the bottom ofthe conduction band (the difference is also referred to as electronaffinity) corresponds to a value obtained by subtracting an energy gapfrom an energy difference between the vacuum level and the top of thevalence band (the difference is also referred to as an ionizationpotential). Note that the energy gap can be measured using aspectroscopic ellipsometer (UT-300 manufactured by HORIBA JOBIN YVONS.A.S., for example). The energy difference between the vacuum level andthe top of the valence band can be measured using an ultravioletphotoelectron spectroscopy (UPS) device (VersaProbe manufactured byULVAC-PHI, Inc., for example).

As illustrated in FIG. 2B, the energy of the bottom of the conductionband continuously changes between the first oxide layer 104 and thefirst oxide semiconductor layer 106 and between the second oxidesemiconductor layer 108 and the second oxide layer 110 without anybarrier between them. This is because oxygen is easily diffused betweenthe first oxide layer 104 and the first oxide semiconductor layer 106,and between the second oxide semiconductor layer 108 and the secondoxide layer 110 due to the similarity in composition, and thus a layerwhat is called a mixed layer is formed therebetween. In addition, theenergy of the bottom of the conduction band continuously changes betweenthe first region 106 a and the second region 106 b without any barrierbetween them. This is because the concentration of the element impartingn-type conductivity to the oxide semiconductor in the first region 106 achanges continuously in the thickness direction.

The element contained in the first region 106 a might be diffused intothe second oxide semiconductor layer 108 by heat treatment after theformation of the second oxide semiconductor layer 108 or the like. Insuch a case, the concentration of the element continuously changes fromthe first region 106 a toward the second oxide semiconductor layer 108.As a result, as illustrated in FIG. 2B, the energy of the bottom of theconduction band continuously changes also between the first region 106 aand the second oxide semiconductor layer 108 without any barriertherebetween.

Accordingly to FIG. 2B, in the oxide stack 115, the first oxidesemiconductor layer 106 and the second oxide semiconductor layer 108each form a first well, and the first region 106 a in the first oxidesemiconductor layer 106 forms a second well in the first well. In otherwords, a buried channel is formed in the oxide stack 115, and a well isfurther formed in the buried channel. Such a structure having two-stagewells can also be referred to as a double well structure. The wellprovided in the first oxide semiconductor layer 106 allows a largercurrent to flow therethrough.

Further, the well formed by the first region 106 a is apart from theinterface between first oxide layer 104 and the base insulating layer102 and the interface between the second oxide layer 110 and the gateinsulating layer 114, and thus trap levels at the interfaces can beprevented from influencing the first region 106 a serving as a maincarrier path of the transistor.

To form the continuous junction illustrated in FIG. 2B, the layers arepreferably stacked sequentially without exposure to the air using adeposition apparatus (sputtering apparatus) of a multi chamber type witha load lock chamber. It is preferable that each chamber of thesputtering apparatus be able to be evacuated to a high vacuum (to about5×10⁻⁷ Pa to 1×10⁻⁴ Pa) by an adsorption vacuum pump such as a cryopumpso that water and the like acting as impurities of the oxidesemiconductor are removed as much as possible. Alternatively, a turbomolecular pump and a cold trap are preferably used in combination toprevent backflow of gas into the chamber through an evacuation system.

Not only high vacuum evacuation in a chamber but also a sputtering gasis highly purified to obtain a high-purity intrinsic oxidesemiconductor. When an oxygen gas or an argon gas used as a sputteringgas is purified so as to have a dew point of −40° C. or lower,preferably −80° C. or lower, more preferably −100° C. or lower, moistureor the like can be prevented from entering an oxide semiconductor asmuch as possible.

The first oxide layer 104 provided under the first oxide semiconductorlayer 106 and the second oxide layer 110 provided over the second oxidesemiconductor layer 108 each serve as a barrier layer and can prevent atrap level formed at an interface between the oxide stack 115 and eachof the insulating layers which are in contact with the oxide stack 115(the base insulating layer 102 and the gate insulating layer 114) fromadversely affecting the first region 106 a of the first oxidesemiconductor layer 106 that serves as a main carrier path for thetransistor.

For example, oxygen vacancies contained in the oxide semiconductor layerexist as localized states at deep energy potential in the energy gap ofthe oxide semiconductor. A carrier is trapped in such localized states,and thereby the reliability of the transistor is lowered. For thisreason, oxygen vacancies contained in the oxide semiconductor layer needto be reduced. In the transistor 200 in this embodiment, the first oxidelayer 104 and the second oxide layer 110 in which oxygen vacancies areless likely to be generated than in the first oxide semiconductor layer106 and the second oxide semiconductor layer 108 are provided to be incontact with the first oxide semiconductor layer 106 and the secondoxide semiconductor layer 108, respectively, whereby oxygen vacancies inthe first oxide semiconductor layer 106 and the second oxidesemiconductor layer 108 can be reduced. For example, in the first oxidesemiconductor layer 106, the absorption coefficient due to the localizedlevels, which is obtained by measurement by a constant photocurrentmethod (CPM) can be controlled to be lower than 1×10⁻³/cm or lower than1×10⁻⁴/cm.

In addition, when the oxide semiconductor layer is in contact with aninsulating layer including a different constituent element (e.g., a baseinsulating layer including a silicon oxide film), an interface state issometimes formed at the interface of the two layers to form a channel.At this time, a second transistor having a different threshold voltageappears, so that an apparent threshold voltage of the transistor isvaried. However, since the first oxide layer 104 contains one or morekinds of metal elements constituting the first oxide semiconductor layer106 in the transistor 200 in this embodiment, an interface state is noteasily formed at an interface between the first oxide layer 104 and thefirst oxide semiconductor layer 106. Thus, providing the first oxidelayer 104 makes it possible to reduce fluctuations in the electricalcharacteristics of the transistor, such as a threshold voltage.

When a channel emerges at an interface between the gate insulating layer114 and the second oxide semiconductor layer 108, interface scatteringoccurs at the interface and the field-effect mobility of the transistoris decreased. However, since the second oxide layer 110 contains one ormore kinds of metal elements constituting the second oxide semiconductorlayer 108 in the transistor 200 in this embodiment, scattering ofcarriers is less likely to occur at an interface between the secondoxide layer 110 and the second oxide semiconductor layer 108, and thusthe field-effect mobility of the transistor can be increased.

Further, the first oxide layer 104 and the second oxide layer 110 eachalso serve as a barrier layer that inhibits formation of an impuritylevel due to the entry of the constituent elements of the baseinsulating layer 102 and the gate insulating layer 114 into the oxidesemiconductor layer (the first oxide semiconductor layer 106 or thesecond oxide semiconductor layer 108).

For example, in the case of using a silicon-containing insulating layeras the base insulating layer 102 or the gate insulating layer 114 thatis in contact with the first oxide layer 104 or the second oxide layer110, the silicon in the insulating layer or carbon that might becontained in the insulating layer enters the first oxide layer 104 orthe second oxide layer 110 at a depth of several nanometers from theinterface in some cases. When an impurity such as silicon or carbonenters the oxide semiconductor layer, an impurity state is formed andthe impurity state serves as a factor of generating an electron, so thatthe oxide semiconductor layer may become n-type.

However, when the thickness of the first oxide layer 104 and the secondoxide layer 110 is larger than several nanometers, the impurity such assilicon or carbon does not reach the oxide semiconductor layer, so thatthe influence of impurity levels is suppressed.

Note that the impurity concentrations of the oxide semiconductor layercan be measured by secondary ion mass spectrometry (SIMS), for example.

<Manufacturing Method of Semiconductor Device>

An example of a manufacturing method of the transistor 200 illustratedin FIGS. 1A to 1C is described with reference to FIGS. 3A to 3E andFIGS. 4A to 4D.

The base insulating layer 102 is formed first over the substrate 100having an insulating surface (see FIG. 3A).

The base insulating layer 102 may have a single-layer structure or astacked structure. Note that at least a region in the base insulatinglayer 102 that is in contact with the first oxide layer 104 formed lateris formed of a material that contains oxygen in order to supply oxygento the oxide stack 115 including the first oxide layer 104. Further, thebase insulating layer 102 is preferably a film containing excess oxygen.

In order to make the base insulating layer 102 contain excess oxygen,the base insulating layer 102 may be formed in an oxide atmosphere, forexample. Alternatively, oxygen is introduced into the base insulatinglayer 102 that has been formed to allow the base insulating layer 102 tocontain excess oxygen. Both the methods may be combined.

The base insulating layer 102 is an insulating layer in contact with thefirst oxide layer 104 and thus it is preferable that the hydrogenconcentration in the base insulating layer 102 be reduced. After theformation of the base insulating layer 102, it is preferable to performheat treatment (dehydration treatment or dehydrogenation treatment) forthe purpose of hydrogen removal.

The heat treatment is performed at a temperature of 250° C. to 650° C.inclusive, preferably 350° C. to 600° C. inclusive, or lower than thestrain point of the substrate. For example, the substrate is put in anelectric furnace that is one of heat treatment apparatuses, and the heattreatment is performed on the base insulating layer 102 at 450° C. in avacuum (reduced-pressure) atmosphere for an hour.

Note that the heat treatment apparatus is not limited to an electricfurnace, and an apparatus for heating an object by thermal conduction orthermal radiation from a heating element such as a resistance heatingelement may be used. For example, an RTA (rapid thermal annealing)apparatus such as a GRTA (gas rapid thermal annealing) apparatus or anLRTA (lamp rapid thermal annealing) apparatus can be used. An LRTAapparatus is an apparatus for heating an object to be processed byradiation of light (an electromagnetic wave) emitted from a lamp such asa halogen lamp, a metal halide lamp, a xenon arc lamp, a carbon arclamp, a high pressure sodium lamp, or a high pressure mercury lamp. AGRTA apparatus is an apparatus for performing heat treatment in which aninert gas that does not react with an object to be processed, such asnitrogen or a rare gas such as argon, is heated at a high temperature.Note that in the case where a GRTA apparatus is used as the heattreatment apparatus, the substrate may be heated in an inert gas heatedto high temperature of 650° C. to 700° C. because the heat treatment canbe conducted in a short time.

The heat treatment may be performed in an atmosphere of nitrogen,oxygen, ultra-dry air (air in which the water content is 20 ppm or less,preferably 1 ppm or less, further preferably 10 ppb or less), or a raregas (argon, helium, or the like). Note that it is preferable that water,hydrogen, or the like be not contained in the atmosphere of nitrogen,oxygen, ultra-dry air, or a rare gas. The purity of nitrogen, oxygen, ora rare gas which is introduced into a heat treatment apparatus ispreferably 6N (99.9999%) or higher, more preferably 7N (99.99999%) orhigher (that is, the impurity concentration is preferably 1 ppm orlower, more preferably 0.1 ppm or lower).

Note that oxygen can be released from the base insulating layer 102 byheat treatment. Accordingly, treatment for introducing oxygen (at leastincluding any of oxygen radicals, ozone, oxygen atoms, and oxygen ions(including oxygen molecular ions and oxygen cluster ions)) to thedehydrated or dehydrogenated base insulating layer 102 is preferablyperformed.

The oxygen supply to the base insulating layer 102 can be performed byan ion implantation method, an ion doping method, a plasma ion immersionion implantation method, plasma treatment, or the like, for example. Agas containing oxygen can be used for oxygen supply treatment. As a gascontaining oxygen, oxygen, dinitrogen monoxide, nitrogen dioxide, or thelike can be used. Further, a rare gas may be included in the gascontaining oxygen for the oxygen supply treatment. By the oxygen supplytreatment on the base insulating layer 102, oxygen that is released byheat treatment can be compensated.

Next, a first oxide film 104A to serve as the first oxide layer 104 andan oxide semiconductor film 106A to serve as the first oxidesemiconductor layer 106 are formed in this order over the baseinsulating layer 102 (see FIG. 3B). The first oxide film 104A and thefirst oxide semiconductor film 106A are formed by a sputtering method, aCVD method, a molecular beam epitaxy (MBE) method, an atomic layerdeposition (ALD) method, or a pulsed laser deposition (PLD) method.

The first oxide film 104A and the first oxide semiconductor film 106Acan be formed using the above-described materials.

For example, when the first oxide film 104A to serve as the first oxidelayer 104 is formed by a sputtering method, a sputtering target with acomposition of In:Ga:Zn=1:3:2 in atomic ratio, a sputtering target witha composition of In:Ga:Zn=1:6:4 in atomic ratio, a sputtering targetwith a composition of In:Ga:Zn=1:9:6 in atomic ratio, or a sputteringtarget having a composition that is close to the compositions of theabove targets is preferably used.

For example, when the first oxide semiconductor film 106A to serve asthe first oxide semiconductor layer 106 is formed by a sputteringmethod, a sputtering target with a composition of In:Ga:Zn=1:1:1 inatomic ratio, a sputtering target with a composition of In:Ga:Zn=3:1:2in atomic ratio, or a sputtering target having a composition that isclose to the compositions of the above targets is preferably used.

As described above, a material of the first oxide film 104A is selectedsuch that the first oxide film 104A has a lower electron affinity thanthe oxide semiconductor film 106A.

Note that the composition of the film formed by a sputtering method maybe different from the composition of the target for forming the film.For example, when an oxide semiconductor film is formed using asputtering target including ZnO, sublimation of ZnO or the like mayoccur during deposition, so that the atomic ratio of Zn to In and/or Gain the deposited oxide semiconductor film is lower than that of thesputtering target.

The first oxide semiconductor film 104A and the first oxidesemiconductor film 106A are preferably formed by a sputtering method. Asthe sputtering method, an RF sputtering method, a DC sputtering method,an AC sputtering method, or the like can be used. In particular, a DCsputtering method is preferably used because dust generated in thedeposition can be reduced and the film thickness can be uniform.

In the formation of the first oxide film 104A and the first oxidesemiconductor film 106A, the hydrogen concentration in the films ispreferably reduced as much as possible. To reduce the hydrogenconcentration, for example, in the case where the films are formed by asputtering method, oxygen, a high-purity rare gas (typically, argon)from which impurities such as hydrogen, water, a compound having ahydroxyl group, and a hydride have been removed, or a mixed gas ofoxygen and a rare gas is used as appropriate as an atmosphere gassupplied to a deposition chamber of a sputtering apparatus.

The first oxide film and the oxide semiconductor film are formed in sucha manner that a sputtering gas from which hydrogen and moisture areremoved is introduced into a deposition chamber while moisture remainingin the deposition chamber is removed, whereby the concentration ofhydrogen in the films can be reduced. In order to remove the residualmoisture in the deposition chamber, an entrapment vacuum pump, forexample, a cryopump, an ion pump, or a titanium sublimation pump ispreferably used. The evacuation unit may be a turbo molecular pumpprovided with a cold trap. When the deposition chamber is evacuated withthe cryopump, which has a high capability in removing a hydrogenmolecule, a compound containing a hydrogen atom such as water (H₂O) (ora compound containing a carbon atom), and the like, the impurityconcentration in the oxide film and the oxide semiconductor film formedin the deposition chamber can be reduced.

Note that oxygen may be supplied into the first oxide film 104A attiming which is after formation of the first oxide film 104A and beforeformation of the first oxide semiconductor film 106A. By the oxygensupply treatment, the first oxide film 104A excessively contains oxygen,so that the excess oxygen can be supplied to the first oxidesemiconductor film 106A by heat treatment in a later film formationstep.

After the formation of the first oxide film 104A and the first oxidesemiconductor film 106A, heat treatment is preferably performed. Theheat treatment may be performed at a heating temperature of 250 to 650°C., preferably 300 to 500° C., in an inert gas atmosphere, an atmospherecontaining an oxidizing gas at 10 ppm or more, or a reduced pressureatmosphere. Alternatively, the heat treatment may be performed in such amanner that heat treatment is performed in an inert gas atmosphere, andthen another heat treatment is performed in an atmosphere containing anoxidizing gas at 10 ppm or more in order to compensate released oxygen.By this heat treatment, impurities such as hydrogen or water can beremoved from at least one of the base insulating layer 102, the firstoxide film 104A, and the first oxide semiconductor film 106A

Note that the above-described heat treatment may be performed after thefirst oxide film 104A and the first oxide semiconductor film 106A areprocessed into an island shape. However, it is preferred that the heattreatment for dehydration or dehydrogenation be performed beforeprocessing in order to exclude an opportunity of oxygen contained in thebase insulating layer 102 to release from a region that is not coveredwith the island-shaped first oxide layer 104 and first oxidesemiconductor layer 106.

Next, the element 130 is supplied into the first oxide semiconductorfilm 106A to form the first region 106 a (see FIG. 3C).

The element 130 can be an impurity that can impart n-type conductivity,for example, phosphorus (P). As the element 130, in addition tophosphorus (P), elements belonging to Group 15 (e.g., nitrogen (N),arsenic (As) and antimony (Sb)), boron (B), aluminum (Al), argon (Ar),helium (He), neon (Ne), indium (In), fluorine (F), chlorine (CO,hydrogen (H), titanium (Ti), or zinc (Zn) may be used.

The element 130 may be included in a state of a radical, an atom, amolecule, or an ion.

Examples of a method for supplying the element 130 to the first oxidesemiconductor film 106A include an ion implantation method, an iondoping method, and a plasma immersion ion implantation method.Alternatively, heat treatment or plasma treatment in an atmospherecontaining the element 130 may be used.

The conditions in the supply of the element 130 are preferably set sothat the element 130 cannot reach the interface between the first oxidesemiconductor film 106A and the first oxide film 104A. The element 130is preferably supplied so that a region having the highest concentrationof the element 130 is located in the vicinity of the surface of thefirst oxide semiconductor film 106A (for example, in a range from thesurface to a thickness of 20 nm or less, preferably 10 nm or less,further preferably 5 nm or less). Alternatively, the element 130 ispreferably supplied in such a manner that a region having the highestconcentration of the element 130 is located in an area that is ¾ or lessof the thickness of the first oxide semiconductor film 106A from thesurface thereof, preferably ½ or less from the surface, furtherpreferably ¼ or less from the surface.

By the supply of the element 130 in such a method, the first region 106a that is an n-type region and the second region 106 b that has a lowerconcentration of the element 130 than that of the first region 106 a canbe formed in the first oxide semiconductor film 106A. The second region106 b is preferably i-type or substantially i-type.

Then, the first oxide film 104A and the first oxide semiconductor film106A are processed into the first oxide layer 104 and the first oxidesemiconductor layer 106 that have an island-like shape (see FIG. 3D).Here, the first oxide layer 104A and the first oxide semiconductor layer106A can be etched by using the same mask. Therefore, the plane shapesof the first oxide layer 104 and the first oxide semiconductor layer 106are identical and the upper end of a side surface of the first oxidelayer 104 coincides with the lower end of a side surface of the firstoxide semiconductor layer 106. In other words, the side surface of thefirst oxide layer 104 and the side surface of the first oxidesemiconductor layer 106 are coplanar.

In this specification and the claims, the term “the same” “identical” or“coincide” does not necessarily mean exactly being the same or exactlycoinciding and include the meaning of being substantially the same,substantially identical or substantially coinciding. For example, shapesobtained by etching using the same mask are expressed as being the sameor identical or coinciding with each other.

In processing into the first oxide layer 104 and the first oxidesemiconductor layer 106, the first oxide film 104A may be over-etched,in which case part of the base insulating layer 102 (the region that isnot covered with the island-shaped first oxide layer 104 and theisland-shaped first oxide semiconductor layer 106) is etched to cause areduction in film thickness of the base insulating layer 102.

Next, a second oxide semiconductor film 108A and a second oxide layer110A are formed in this order to cover the side surfaces and the topsurface of the first oxide semiconductor layer 106 (FIG. 3E).

The second oxide semiconductor film 108A to serves as the second oxidesemiconductor layer 108 and the second oxide layer 110A to serve as thesecond oxide layer 110 can be formed using any of the described-abovematerials. In addition, the formation method thereof can be the same asthat of the first oxide film 104A or the first oxide semiconductor film106A.

For example, when the second oxide semiconductor film 108A is formed bya sputtering method, the same sputtering target as the sputtering targetused for the formation of the first oxide semiconductor film 106A ispreferably used. In this case, a sputtering target containing indium,gallium, and zinc at an atomic ratio of 1:3:2, a sputtering targetcontaining indium, gallium, and zinc at an atomic ratio of 1:6:4, asputtering target containing indium, gallium, and zinc at an atomicratio of 1:9:6, a sputtering target having a composition that is closeto the compositions of the above targets is preferably used.

After the formation of the second oxide semiconductor film 108A and thesecond oxide layer 110A, heat treatment is preferably performed. Theheat treatment may be performed at a temperature higher than or equal to250° C. and lower than or equal to 650° C., preferably higher than orequal to 300° C. and lower than or equal to 500° C., in an inert gasatmosphere, an atmosphere containing an oxidizing gas at 10 ppm or more,or a reduced pressure state. Alternatively, the heat treatment may beperformed in such a manner that heat treatment is performed in an inertgas atmosphere, and then another heat treatment is performed in anatmosphere containing an oxidization gas at 10 ppm or more, in order tocompensate desorbed oxygen. By the heat treatment, an impurity such ashydrogen or water can be removed from the base insulating layer 102, thefirst oxide layer 104, the first oxide semiconductor layer 106, thesecond oxide semiconductor film 108A, or the second oxide layer 110A.Further, by the heat treatment, oxygen can be supplied from the baseinsulating layer 102 to the oxide stack 115 formed over the baseinsulating layer 102.

The heat treatment may be performed at any timing as long as it isperformed after the first oxide semiconductor film 106A is formed andmay be performed repeatedly. For example, the heat treatment may beperformed just after the formation of the first oxide semiconductorlayer 106, just after the formation of the second oxide layer 110, or ina later step.

Then, the second oxide semiconductor film 108A and the second oxidelayer 110A are processed by a photolithography process or the like, sothat the second oxide semiconductor layer 108 and the second oxide layer110 are formed (see FIG. 4A). Here, the second oxide semiconductor layer108 and the second oxide layer 110 can be formed by etching using thesame mask. Therefore, the plane shapes of the second semiconductor oxidelayer 108 and the second oxide layer 110 are identical and the upper endof a side surface of the second oxide semiconductor layer 108 coincideswith the lower end of a side surface of the second oxide layer 110.

By this etching process, the oxide stack 115 including the first oxidelayer 104, the first oxide semiconductor layer 106, the second oxidesemiconductor layer 108, and the second oxide layer 110 is formed.

In the processing into the second oxide semiconductor layer 108 and thesecond oxide layer 110, a part of the base insulating layer 102 (aregion not covered with the island-like second oxide semiconductor layer108 and the island-like second oxide layer 110) is etched and thinned byoveretching of the second oxide semiconductor film 108A in some cases.

Then, a conductive film is formed over the second oxide layer 110 and isprocessed to form the source electrode layer 112 a and the drainelectrode layer 112 b (FIG. 4B).

Note that the source electrode layer 112 a and the drain electrode layer112 b may have shapes having some steps at their end portions in such away that a step of making a resist mask recede by ashing and an etchingstep are alternately performed more than once. It is preferable that thenumber of steps be increased as the thickness of each of the sourceelectrode layer 112 a and the drain electrode layer 112 b is larger. Theend portions of the source electrode layer 112 a and the drain electrodelayer 112 b are not necessarily symmetrical. In addition, a curvedsurface with a given curvature radius may be provided between the topsurface and the side surface of each step.

When each of the source electrode layer 112 a and the drain electrodelayer 112 b has a shape including a plurality of steps as describedabove, coverage with the films formed over the source electrode layer112 a and the drain electrode layer 112 b, specifically, coverage withthe gate insulating layer 114 and the like is improved, so that thetransistor can have more improved electrical characteristics andreliability.

When the source electrode layer 112 a and the drain electrode layer 112b are processed, a part of the base insulating layer 102 and a part ofthe second oxide layer 110 (regions not covered with the sourceelectrode layer 112 a and the drain electrode layer 112 b) are etcheddue to overetching of the conductive film, thereby the thicknesses arereduced.

Note that if the conductive film to serve as the source electrode layer112 a and the drain electrode layer 112 b remains over the oxide stack115 as a residue, the residue may form an impurity state in the oxidestack 115 or at the interface thereof. Further, oxygen extraction fromthe oxide stack 115 may be caused by the residue to form an oxygenvacancy.

Therefore, treatment for removing the residue may be performed on thesurface of the second oxide layer 110 after the source electrode layer112 a and the drain electrode layer 112 b are formed. As the treatmentfor removing the residue, etching treatment (e.g., wet etching) orplasma treatment using oxygen or dinitrogen monoxide may be employed.The treatment for removing the residue may reduce the thickness of thesecond oxide layer 110 between the source electrode layer 112 a and thedrain electrode layer 112 b by 1 nm or more and 3 nm or less.

Next, the gate insulating layer 114 is formed over the oxide stack 115,the source electrode layer 112 a, and the drain electrode layer 112 b.

The gate insulating layer 114 can be formed using aluminum oxide,magnesium oxide, silicon oxide, silicon oxynitride, silicon nitrideoxide, silicon nitride, gallium oxide, germanium oxide, yttrium oxide,zirconium oxide, lanthanum oxide, neodymium oxide, hafnium oxide,tantalum oxide, or the like. Note that the gate insulating layer 114 maybe a stacked film of any of the above materials. The gate insulatinglayer 114 can be formed by a sputtering method, a CVD method, an MBEmethod, an ALD method, a PLD method, or the like.

Like the base insulating layer 102 described above, the gate insulatinglayer 114 may have a function of supplying oxygen to the oxide stack115, and is preferably formed using an insulating layer containingoxygen.

Heat treatment may be performed after the gate insulating layer 114 isformed. The heat treatment can be performed under the same conditions asthose described above.

Then, a conductive film is formed over the gate insulating layer 114,and an unnecessary portion is etched so that the gate electrode layer116 is formed (see FIG. 4C).

After the formation of the gate electrode layer 116, heat treatment maybe performed. The heat treatment can be performed under conditionssimilar to those described above.

Then, the insulating layer 118 and the insulating layer 120 are stackedin this order over the gate insulating layer 114 and the gate electrodelayer 116.

The insulating layer 118 and the insulating layer 120 can be formedusing aluminum oxide, magnesium oxide, silicon oxide, siliconoxynitride, silicon nitride oxide, silicon nitride, gallium oxide,germanium oxide, yttrium oxide, zirconium oxide, lanthanum oxide,neodymium oxide, hafnium oxide, tantalum oxide, or the like. Note thatthe insulating layer 118 and the insulating layer 120 may be a stackedlayer of any of the above materials. The insulating layer 118 and theinsulating layer 120 can be formed by a sputtering method, a CVD method,an MBE method, an ALD method, a PLD method, or the like.

Further, the insulating layer 118 is preferably formed using a layerwith a low oxygen permeability (or a layer with an oxygen barrierproperty). Examples of a material for the layer with a low oxygenpermeability include aluminum oxide, and nitrides such as siliconnitride, and silicon nitride oxide. By providing the insulating layer118 with a low oxygen permeability to cover the gate insulating layer114, oxygen that will be released from the base insulating layer 102 orthe like by heat treatment performed later can be prevented from beingreleased outside through the insulating layer 118 and the oxygen can besupplied to the oxide stack 115 effectively.

Alternatively, the insulating layer 118 may be a layer containing oxygen(containing excess oxygen) that can be a source of oxygen to the oxidestack 115, and the insulating layer 120 may be a layer with a low oxygenpermeability. In this case, oxygen released from the insulating layer118 by heat treatment is inhibited from being released outside throughthe insulating layer 120, so that the oxygen can efficiently supplied tothe oxide stack 115.

After the formation of the insulating layer 118, or the formation of theinsulating layer 118 and the insulating layer 120, heat treatment may beperformed. The heat treatment can be performed under conditions similarto those described above. By the heat treatment, oxygen can beeffectively supplied to the oxide stack 115 from the layer containingoxygen that surrounds the oxide stack 115, and thereby, the amount ofoxygen vacancies in the first oxide semiconductor layer 106 and thesecond oxide semiconductor layer 108 can be reduced.

Then, the insulating layer 120 and the insulating layer 118 areselectively etched to form an opening portion reaching the sourceelectrode layer 112 a and an opening portion reaching the drainelectrode layer 112 b.

Then, a conductive film is formed over the insulating layer 120 and anunnecessary portion is removed by etching to form the electrode layer122 a electrically connected to the source electrode layer 112 a and theelectrode layer 122 b electrically connected to the drain electrodelayer 112 b (see FIG. 4D).

As materials of the electrode layer 122 a and the electrode layer 122 b,materials that can be used for the source electrode layer 112 a, thedrain electrode layer 112 b, or the gate electrode layer 116 can beused.

Through the above-described steps, the transistor 200 can bemanufactured.

<Structure Example 2 of Semiconductor Device>

FIG. 5 illustrates a structural example of a transistor 210. In theoxide stack 115 of the transistor 210 illustrated in FIG. 5, the secondoxide semiconductor layer 108 is formed to be in contact with the topsurface of the first oxide layer 104 that is not covered with the firstoxide semiconductor layer 106 and the side surfaces and the top surfaceof the first oxide semiconductor layer 106. In this manner, an endportion of the second oxide semiconductor layer 108 is covered with thesecond oxide layer 110. In other words, a side surface of the secondoxide semiconductor layer 108 is in contact with the second oxide layer110. The other components of the transistor 210 are similar to those ofthe transistor 200; thus, detailed description thereof is omitted here.

The formation method of the oxide stack 115 included in the transistor210 is described below. As in the steps in FIGS. 3A to 3C, the baseinsulating layer 102, the first oxide film 104A, and the first oxidesemiconductor film 106A including the first region 106 a and the secondregion 106 b are formed first over the substrate 100.

Then, the first oxide semiconductor film 106A is processed by aphotolithography process or the like to form the first oxidesemiconductor layer 106 having an island-like shape over the first oxidefilm 104A. At this time, a preferable etching condition for the firstoxide semiconductor film 106A is one that can give a sufficiently highetching selectivity with respect to the first oxide film 104A. If thecomposition of the first oxide film 104A is close to the composition ofthe first oxide semiconductor film 106A or a sufficiently high etchingselectivity is not given, for example, the first oxide film 104A mightbe etched, leading to partial thinning of the first oxide film 104A.

Then, the second oxide semiconductor film 108A is formed over the firstoxide film 104A to cover the first oxide semiconductor layer 106 havingan island-like shape. The first oxide film 104A and the second oxidesemiconductor film 108A are processed by a photolithography process orthe like to form the first oxide layer 104 and the second oxidesemiconductor layer 108. Here, the first oxide layer 104 and the secondoxide semiconductor layer 108 can be formed by etching using the samemask. Therefore, the plane shapes of the first oxide layer 104 and thesecond oxide semiconductor layer 108 are identical and the upper end ofa side surface of the first oxide layer 104 coincides with the lower endof a side surface of the second oxide semiconductor layer 108.

When the first oxide film 104A and the second oxide semiconductor film108A are processed into the first oxide layer 104 and the second oxidesemiconductor layer 108, a part (a region not covered with the firstoxide layer 104 having an island-like shape and the second oxidesemiconductor layer 108 having an island-like shape) of the baseinsulating layer 102 might be etched to be thinned because ofoveretching of the first oxide film 104A.

After that, the second oxide layer 110A is formed to cover the sidesurfaces of the first oxide layer 104 and the side surfaces and the topsurface of the second oxide semiconductor layer 108, and processed by aphotolithography process or the like to form the second oxide layer 110.Through the above steps, the oxide stack 115 included in the transistor210 can be formed.

The oxide stack 115 formed in the above manner has a structure in whichthe first oxide semiconductor layer 106 is surrounded by the first oxidelayer 104 and the second oxide semiconductor layer 108. In other words,at the end portion of the second oxide semiconductor layer 108, thesecond oxide semiconductor layer 108 is in contact with the first oxidelayer 104, not with the base insulating layer 102. Thus, an impuritysuch as silicon can be further inhibited from entering the first oxidesemiconductor layer 106. In addition, the side surfaces of the secondoxide semiconductor layer 108 are covered with the second oxide layer110; therefore, oxygen can be inhibited from being released from theside surfaces.

<Structural Example 3 of Semiconductor Device>

FIGS. 6A to 6C illustrate a structural example of a transistor 220. FIG.6A is a plan view of the transistor 220, FIG. 6B is a cross-sectionalview of the transistor 220 taken along the line V2-W2 in FIG. 6A andFIG. 6C is a cross-sectional view of the transistor 220 taken along theline X2-Y2 in FIG. 6A.

In the oxide stack 115 of the transistor 220 illustrated in FIGS. 6A to6C, the second oxide layer 110 is formed over the source electrode layer112 a and the drain electrode layer 112 b to be in contact with part ofthe second oxide semiconductor layer 108, which is not covered with thesource electrode layer 112 a and the drain electrode layer 112 b. In thetransistor 220, the second oxide layer 110 and the gate insulating layer114 are etched in a self-alignment manner with the gate electrode layer116 used as a mask. In other words, the second oxide layer 110, the gateinsulating layer 114, and the gate electrode layer 116 have the sameplane shapes in the transistor 220. The other components of thetransistor 220 are similar to those of the transistor 200; thus,detailed description thereof is omitted here.

The formation method of the oxide stack 115 included in the transistor220 is described with reference to FIGS. 7A to 7D. As in the steps ofFIGS. 3A to 3D, the base insulating layer 102, the first oxide layer104, and the first oxide semiconductor layer 106 including the firstregion 106 a and the second region 106 b are formed over the substrate100.

Then, the second oxide semiconductor film is formed to cover the firstoxide layer 104 having an island-like shape and the first oxidesemiconductor layer 106 having an island-like shape. The second oxidesemiconductor film is processed by a photolithography process or thelike, and thereby the second oxide semiconductor layer 108 in contactwith a part of the base insulating layer 102 is formed to cover the sidesurfaces of the first oxide layer 104 and the side surfaces and the topsurface of the first oxide semiconductor layer 106 (see FIG. 7A).

In the processing into the second oxide semiconductor layer 108, a part(a region not covered with the second oxide semiconductor layer 108having an island-like shape) of the base insulating layer 102 can beetched to be thinned because of overetching of the second oxidesemiconductor film 108A.

After that, in a manner similar to the step of FIG. 4B, a conductivefilm is formed over the second oxide semiconductor layer 108 and isprocessed to form the source electrode layer 112 a and the drainelectrode layer 112 b. When the conductive film is processed, a part (aregion not covered with the source electrode layer 112 a and the drainelectrode layer 112 b) of the base insulating layer 102 and/or thesecond oxide semiconductor layer 108 is etched to be thinned in somecases.

Then, the second oxide layer 110A is formed over the source electrodelayer 112 a and the drain electrode layer 112 b to be in contact withthe second oxide semiconductor layer 108 exposed between the sourceelectrode layer 112 a and the drain electrode layer 112 b, and the gateinsulating layer 114 is formed over the second oxide layer 110A (seeFIG. 7B).

By successive formation of the second oxide layer 110A and the gateinsulating layer 114 without exposure to the air, impurities such ashydrogen and moisture can be prevented from being adsorbed onto asurface of the second oxide layer 110A, which is preferable.

Note that, if a part of the base insulating layer 102 is exposed bypatterning the second oxide layer 110A prior to the formation of thegate insulating layer 114, oxygen might be released from the baseinsulating layer 102 to the outside (e.g., deposition atmosphere) byheating at the time of forming the gate insulating layer 114. The baseinsulating layer 102 is a layer serving as a source of oxygen to theoxide stack 115, and the release of oxygen from the base insulatinglayer 102 to the outside leads to a reduction in oxygen supplied to thefirst oxide semiconductor layer 106 and may consequently causegeneration of oxygen vacancies in the oxide stack 115. However, in themanufacturing method of the transistor 220 illustrated in FIGS. 7A to7D, because the base insulating layer 102 is covered with the secondoxide layer 110A at the formation of the gate insulating layer 114,oxygen can be prevented from being released from the base insulatinglayer 102. Therefore, the oxygen vacancies that can be formed in theoxide stack 115 in the transistor 220 can be reduced.

Then, as in the step of FIG. 4C, the gate electrode layer 116 is formedover the gate insulating layer 114, and the gate insulating layer 114and the second oxide layer 110A are processed in a self-alignment mannerwith the gate electrode layer 116 used as a mask (see FIG. 7C).

By processing the second oxide layer 110A into the second oxide layer110, outward diffusion of indium contained in the second oxide layer 110can be prevented. The outward diffusion of indium is a factor causingvariations in electrical characteristics of transistors or a factor ofcontamination in a deposition chamber in the process. Thus, theprocessing for forming the second oxide layer 110 using the gateelectrode layer 114 as a mask is effective. Furthermore, in a laterstep, the processing for forming the second oxide layer 110 can preventgeneration of an etching residue for the following reason. If the secondoxide layer 110A remains in contact hole formation regions at the timeof forming contact holes that electrically connect the source and drainelectrode layers 112 a and 112 b to the electrode layers 122 a and 122b, an etching residue tends to be generated owing to the difference inetching rate between the second oxide layer 110A and the insulatinglayer 118 or the insulating layer 120 that are formed later.Accordingly, the formation of the second oxide layer 110 can prevent theresidue from being generated.

Note that the processing for forming the second oxide layer 110 and thegate insulating layer 114 can be performed before the gate electrodelayer 116 is formed. In such a case, the photomask used for theprocessing for forming the first oxide layer 104 and the first oxidesemiconductor layer 106 or the photomask for forming the second oxidesemiconductor layer 108 is preferably used for the processing forforming the second oxide layer 110 and the gate insulating layer 114 toreduce the number of masks. Note that if a resist mask is formed incontact with the second oxide layer 110, a surface of the second oxidelayer 110 might be damaged (e.g., contamination with impurities, areduction in thickness, or generation of oxygen vacancies) by chemicalsolution treatment for removing the resist mask or the like.Accordingly, the processing for forming the second oxide layer 110 ispreferably performed with use of a resist mask formed over the gateinsulating layer 114.

After that, as in the step of FIG. 4D, the insulating layer 118 and theinsulating layer 120 are formed and the electrode layer 122 a and theelectrode layer 122 b electrically connected to the source electrodelayer 112 a and the drain electrode layer 112 b through contact holesformed in the insulating layer 118 and the insulating layer 120 areformed (see FIG. 7D).

Through the steps, the transistor 220 can be formed.

<Structural Example 4 of Semiconductor Device>

FIGS. 8A to 8D illustrates structural examples of a transistor 230 and atransistor 240.

FIG. 8A is a plan view of the transistor 230, FIG. 8B is across-sectional view of the transistor 230 taken along the line V3-W3 inFIG. 8A and FIG. 8C is a cross-sectional view of the transistor 230taken along the line X3-Y3 in FIG. 8A.

The transistor 230 is different from the transistor 200 in the shape ofthe gate electrode layer 116, but the other components are identical.The other components of the transistor 230 are similar to those of thetransistor 200; thus, detailed description thereof is omitted here.

The gate electrode layer 116 of the transistor 230 is overlapped withthe source electrode layer 112 a but is not overlapped with the drainelectrode layer 112 b. The withstand voltage between a gate and a draincan be improved in such a manner that the drain electrode layer 112 b isformed to be apart from and not to be overlapped with the gate electrodelayer 116. Accordingly, even when the transistor 230 is driven by anextremely high voltage, a high reliability can be secured.

FIG. 8D is a cross-sectional view of the transistor 240. The transistorillustrated in FIG. 8D includes the gate electrode layer 116 that isoverlapped with the source electrode layer 112 a but is not overlappedwith the drain electrode layer 112 b, in a similar manner to that of thetransistor 230.

In addition, as in the transistor 220 in FIGS. 6A to 6C, the transistor240 has a structure in which the second oxide layer 110 in the oxidestack 115 is formed over the source electrode layer 112 a and the drainelectrode layer 112 b to be in contact with a part of the second oxidesemiconductor layer 108, which is not covered with the source electrodelayer 112 a and the drain electrode layer 112 b. Because the gateelectrode layer 116 is not overlapped with the drain electrode layer 112b in the transistor 240, it is difficult to process the second oxidefilm with the gate electrode layer 116 used as a mask, as described inthe manufacturing process of the transistor 220.

Therefore, it is preferable to form a mask over the gate insulatinglayer 114 by a photolithography process or the like for forming thesecond oxide layer 110. Alternatively, a photomask used for forming thefirst oxide layer 104 and the first oxide semiconductor layer 106 or aphotomask used for forming the second oxide semiconductor layer 108 ispreferably used, in which case the number of masks can be reduced.

The structures, the methods, and the like described in this embodimentcan be combined as appropriate with any of the structures, the methods,and the like described in the other embodiments.

Embodiment 2

In this embodiment, one embodiment of a semiconductor device and amethod for manufacturing the semiconductor device, which is differentfrom Embodiment 1, will be described with reference to FIGS. 9A to 9D,FIGS. 10A to 10D, FIGS. 11A to 11C, and FIGS. 12A to 12D. In thisembodiment, for the same portions as Embodiment 1 or portions havingfunctions similar to those in Embodiment 1, Embodiment 1 can be referredto and repetitive description is omitted. In this embodiment, a top gatetransistor including an oxide semiconductor layer will be described asan example of the semiconductor device.

<Structure Example 5 of Semiconductor Device>

FIGS. 9A to 9C illustrate a structural example of a transistor 250. FIG.9A is a plan view of the transistor 250, FIG. 9B is a cross-sectionalview of the transistor 250 taken along the line V4-W4 in FIG. 9A andFIG. 9C is a cross-sectional view of the transistor 250 taken along theline X4-Y4 in FIG. 9A.

An oxide stack 165 included in the transistor 250 illustrated in FIGS.9A to 9C includes a first oxide layer 154, a first oxide semiconductorlayer 156, a second oxide semiconductor layer 158, and a second oxidelayer 160. In addition, the first oxide semiconductor layer 156 includesa first region 156 a containing an impurity imparting n-typeconductivity and a second region 156 b that is i-type or substantiallyi-type. The components of the transistor 250 other than the oxide stack165 in FIGS. 9A to 9C are the same as those of the transistor 200illustrated in FIGS. 1A to 1C.

The first oxide semiconductor layer 156 and the second oxidesemiconductor layer 158 included in the oxide stack 165 preferablyinclude at least indium (In) or zinc (Zn). Alternatively, both In and Znare preferably included. In order to reduce fluctuations in electricalcharacteristics of the transistors including the oxide semiconductorlayer, the oxide semiconductor layer preferably contains a stabilizer inaddition to indium and zinc. Specifically, similar materials to that ofthe first oxide semiconductor layer 106 or the second oxidesemiconductor layer 108 can be used.

The first oxide layer 154 included in the oxide stack 165 can have astructure similar to that of the first oxide layer 104 described above.In addition, the second oxide layer 160 included in the oxide stack 165can have the same structure as that of the second oxide layer 110.

The first region 156 a included in the first oxide semiconductor layer156 is formed in such a manner that an impurity imparting n-typeconductivity is supplied with the source electrode layer 112 a and thedrain electrode layer 112 b used as a mask. Thus, in the plan view, oneof the end portions in the channel length direction of the first region156 a coincides with an end portion on the channel side of the sourceelectrode layer 112 a, and the other of the end portions in the channellength direction of the first region 156 a coincides with an end portionon the channel side of the drain electrode layer 112 b. As illustratedin FIG. 9B, the first region 156 a in the channel width directionextends to the end portion of the first oxide semiconductor layer 156and is in contact with the gate insulating layer 114.

In addition, the first oxide semiconductor layer 156 includes the secondregion 156 b that is i-type or substantially i-type in areas overlappingwith the source electrode layer 112 a and the drain electrode layer 112b and in the vicinity of the interface with the first oxide layer 154.

The second oxide semiconductor layer 158 is formed to be in contact withthe first region 156 a of the first oxide semiconductor layer 156 and tocover the top surface of the first oxide semiconductor layer 156. Thesecond oxide semiconductor layer 158 preferably includes i-type orsubstantially i-type oxide semiconductor.

The transistor 250 includes the second region 156 b and the second oxidesemiconductor layer 158 that are i-type or substantially i-type betweenthe first region 156 a and the source electrode layer 112 a and betweenthe first region and the drain electrode layer 112 b, and thus on/offoperations of the transistor can be performed reliably. Furthermore, thetransistor 250 can be normally off.

The transistor 250 includes the first region 156 a containing animpurity imparting n-type conductivity in a region overlapping with thegate electrode layer 116 in the first oxide semiconductor layer 156where a channel is formed; therefore, the series resistance can bereduced between a source and a drain when the transistor 250 is on. As aresult, the current flowing between the source and the drain in the onstate (also referred to as on-state current) can be increased.

The oxide stack 165 included in the transistor 250 can be formed by aone-mask etching step, leading to reduction in the number ofmanufacturing steps and the cost of the semiconductor device.

A transistor 260 illustrated in FIG. 9D is a variation of the transistor250. The transistor 260 is different from the transistor 250 in theshape of the gate electrode layer 116 and the other components areidentical.

The gate electrode layer 116 of the transistor 260 is overlapped withthe source electrode layer 112 a but not overlapped with the drainelectrode layer 112 b, as in the transistors 230 and 240 inEmbodiment 1. The withstand voltage between a gate and a drain can beimproved in such a manner that the drain electrode layer 112 b is formedto be apart from and not to be overlapped with the gate electrode layer116. Accordingly, even when the transistor 260 is driven by an extremelyhigh voltage, a high reliability can be secured.

Next, an example of a method for manufacturing the transistor 250 isdescribed using FIGS. 10A to 10D.

The base insulating layer 102 is formed over the substrate 100, and afirst oxide film 154A, a first oxide semiconductor film 156A, a secondoxide semiconductor film 158A, and a second oxide film 160A are stackedover the base insulating layer 102 (see FIG. 10A). Note that instead ofthe stacked structure of the first oxide semiconductor film 156A and thesecond oxide semiconductor film 158A, a single layer of oxidesemiconductor film may be employed.

For the formation of the first oxide film 154A, the first oxidesemiconductor film 156A, the second oxide semiconductor film 158A, andthe second oxide film 160A, refer to the formation process of the firstoxide film 104A, the first oxide semiconductor film 106A, the secondoxide semiconductor film 108A, and the second oxide layer 110A inEmbodiment 1.

Then, the first oxide film 154A, the first oxide semiconductor film156A, the second oxide semiconductor film 158A, and the second oxidefilm 160A are processed by a photolithography process or the like toform the first oxide layer 154, the first oxide semiconductor layer 156,the second oxide semiconductor layer 158, and the second oxide layer 160(see FIG. 10B). Here, the first oxide film 154A, the first oxidesemiconductor film 156A, the second oxide semiconductor film 158A, andthe second oxide film 160A can be processed by etching with use of thesame mask. Therefore, the plane shapes of the first oxide layer 154, thefirst oxide semiconductor layer 156, the second oxide semiconductorlayer 158, and the second oxide layer 160 are identical with each other,that is, an upper end of a side surface of the first oxide layer 154coincides with a lower end of a side surface of the first oxidesemiconductor layer 156, an upper end of a side surface of the firstoxide semiconductor layer 156 coincides with a lower end of a sidesurface of the second oxide semiconductor layer 158, and an upper end ofa side surface of the second oxide semiconductor layer 158 coincideswith a lower end of a side surface of the second oxide layer 160.

Through this processing, the oxide stack 165 including the first oxidelayer 154, the first oxide semiconductor layer 156, the second oxidesemiconductor layer 158, and the second oxide layer 160 is formed.

In the processing into the oxide stack 165, a part (a region not coveredwith the oxide stack 165 having an island-like shape) of the baseinsulating layer 102 is etched to be thinned due to overetching of thefirst oxide film 154A in some cases.

Then, as in the step of FIG. 4B, a conductive film is formed over thesecond oxide layer 160, and the conductive film is processed to form thesource electrode layer 112 a and the drain electrode layer 112 b (seeFIG. 10C). In the processing into the source electrode layer 112 a andthe drain electrode layer 112 b, a part of the base insulating layer 102is etched to be thinned due to overetching of the conductive film insome cases.

After that, with the source electrode layer 112 a and the drainelectrode layer 112 b used as a mask, an element 131 is supplied intothe first oxide semiconductor layer 156 through the second oxide layer160 and thus the first region 156 a containing the element 131 is formed(see FIG. 10D). Here, the element 131 is included in a region that is apart of the first oxide semiconductor layer 156, and is overlapped withneither the source electrode layer 112 a nor the drain electrode layer112 b.

The element 131 is preferably an element with an oxygen affinity. Whensuch an element with an oxygen affinity is supplied into the first oxidesemiconductor layer 156, the element extracts oxygen contained in thefirst oxide semiconductor layer 156 to form an oxygen vacancy, and thusthe first region 156 a supplied with the element becomes an n-typeregion.

Examples of the element with an oxygen affinity are tungsten (W),titanium (Ti), boron (B), aluminum (Al), and zinc (Zn). Furthermore, theelement 131 may be included in a state of a radical, an atom, amolecule, or an ion.

For the method for supplying the element 131, refer to the method forsupplying the element 130 described above.

Note that the conditions for supplying the element 131 are preferablydetermined so that the element 131 cannot reach the interface betweenthe first oxide semiconductor layer 156 and the first oxide layer 154.The element 131 is preferably supplied to an area in the vicinity of theinterface between the first oxide semiconductor layer 156 and the secondoxide semiconductor layer 158 on the first oxide semiconductor layer 156side (for example, in the area that is 20 nm or less from the interface,preferably 10 nm or less from the interface, further preferably 5 nm orless from the interface). Alternatively, the element 131 is preferablysupplied in such a manner that a region having the highest concentrationof the element 131 is located in an area that is ¾ or less of thethickness of the first oxide semiconductor layer from the interface,preferably ½ or less from the interface, further preferably ¼ or lessfrom the interface.

Note that it is difficult to supply the element 131 into only the firstoxide semiconductor layer 156, and thus the element 131 might becontained in areas that are in the second oxide semiconductor layer 158and the second oxide layer 160 and are overlapped with neither thesource electrode layer 112 a nor the drain electrode layer 112 b.

Thus, with the source electrode layer 112 a and the drain electrodelayer 112 b used as a mask, oxygen 132 is supplied into the second oxidelayer 160 and the second oxide semiconductor layer 158 (see FIG. 11A).By supplying oxygen, an oxygen vacancy that can be formed in the secondoxide semiconductor layer 158 and the second oxide layer 160 by thesupplied element 131 can be compensated. By this supply of oxygen, thesecond oxide layer 160 and the second oxide semiconductor layer 158 canbe made i-type or substantially i-type.

The supply of oxygen 132 can be performed by an ion implantation method,an ion doping method, a plasma ion immersion implantation method, plasmatreatment, or the like, for example. A gas containing oxygen can be usedfor the supply of oxygen. As a gas containing oxygen, oxygen, dinitrogenmonoxide, nitrogen dioxide, or the like can be used. Further, a rare gasmay be included in the gas containing oxygen for the oxygen supplytreatment.

The conditions for supplying the oxygen 132 are preferably determinedsuch that a region having the highest concentration of the oxygen 132 isformed closer to the upper surface of the oxide stack 165 than theregion having the highest concentration of the element 131 suppliedearlier. In this manner, the first region 156 a that is an n-type regioncan be formed in the first oxide semiconductor layer 156, and the secondoxide semiconductor layer 158 and the second oxide layer 160 that arei-type or substantially i-type regions can be formed between the firstregion 156 a and the upper surface of the oxide stack 165. In otherwords, a double-well structure illustrated in FIGS. 2A and 2B can beformed in the energy band. Accordingly, the transistor 250 including theoxide stack 165 can feed a large amount of current.

Note that the second oxide layer 160 and/or the second oxidesemiconductor layer 158 may be made i-type or substantially i-type byplasma treatment such as oxygen plasma treatment or N₂O plasmatreatment, or O₂ ashing treatment, instead of supplying the oxygen 132.Alternatively, the oxygen plasma treatment or N₂O plasma treatment, orthe O₂ ashing treatment may be combined with the supply of the oxygen132.

The step of supplying the element 131 in FIG. 10D and the step ofsupplying the oxygen 132 in FIG. 11A can both be performed inself-alignment manners with use of the source electrode layer 112 a andthe drain electrode layer 112 b as a mask, and thus the process can beperformed with high controllability without an increase in the number ofmasks.

Then, as in the step of FIG. 4C, the gate insulating layer 114 and thegate electrode layer 116 are formed over the oxide stack 165 (see FIG.11B).

Then as in the step of FIG. 4D, the insulating layer 118 and theinsulating layer 120 are formed over the gate electrode layer 116, andthe electrode layer 122 a and the electrode layer 122 b electricallyconnected to the source electrode layer 112 a and the drain electrodelayer 112 b through contact holes formed in the insulating layer 118 andthe insulating layer 120 are formed (see FIG. 11C).

In the above manner, the transistor 250 can be formed.

<Structure Example 6 of Semiconductor Device>

FIGS. 12A to 12C illustrate a structural example of a transistor 270.FIG. 12A is a plan view of the transistor 270, FIG. 12B is across-sectional view of the transistor 270 taken along the line V5-W5 inFIG. 12A, and FIG. 12C is a cross-sectional view of the transistor 270taken along the line X5-Y5 in FIG. 12A.

The transistors illustrated in FIGS. 12A to 12D are variations of thetransistor 250, and have a structure in which the second oxide layer 160is formed over the source electrode layer 112 a and the drain electrodelayer 112 b to be in contact with part of the second oxide semiconductorlayer 158, which is not covered with the source electrode layer 112 aand the drain electrode layer 112 b.

In the transistor 270, the first region 156 a included in the firstoxide semiconductor layer 156 can be formed in the following manner: thesource electrode layer 112 a and the drain electrode layer 112 b areformed over the first oxide layer 154, the first oxide semiconductorlayer 156, and the second oxide semiconductor layer 158 that have anisland-like shape, and an element with an oxygen affinity is suppliedwith the source electrode layer 112 a and the drain electrode layer 112b used as a mask as in the step of FIG. 10D.

In addition, in the step of supplying the element with an oxygenaffinity, the element may be supplied into a region overlapping with thefirst region 156 a in the second oxide semiconductor layer 158. Thus,after the step of supplying the element with an oxygen affinity, oxygenis preferably supplied into the region overlapping with the first region156 a in the second oxide semiconductor layer 158. The step of supplyingoxygen may be performed as in the formation process of the transistor250 or oxygen contained in the second oxide layer 160 formed in contactwith the second oxide semiconductor layer 158 may be diffused by heattreatment.

The transistor 280 illustrated in FIG. 12D is a variation of thetransistor 270, and is different from the transistor 270 in the shape ofthe gate electrode layer 116, and the other components of the transistor280 are the same as those of the transistor 270.

The gate electrode layer 116 of the transistor 280 is overlapped withthe source electrode layer 112 a but is not overlapped with the drainelectrode layer 112 b, as in the transistors 230 and 240 inEmbodiment 1. The withstand voltage between a gate and a drain can beimproved in such a manner that the drain electrode layer 112 b is formedto be apart from and not to be overlapped with the gate electrode layer116. Accordingly, even when the transistor 280 is driven by an extremelyhigh voltage, a high reliability can be secured.

As described above, because each transistor in this embodiment has astructure in which the first region 156 a containing an impurityimparting n-type conductivity is formed in a region overlapping with thegate electrode layer 116 in the first oxide semiconductor layer 156where a channel is formed, the series resistance between a source and adrain of the transistor in an on state can be reduced. As a result,current flowing between the source and the drain in the on state (thecurrent is also referred to as on-state current) can be increased.

In addition, the impurity imparting n-type conductivity is supplied in aself-alignment manner with the source electrode layer 112 a and thedrain electrode layer 112 b used as a mask; therefore, thecontrollability and yield in manufacturing the semiconductor device canbe improved.

Furthermore, because the second region 156 b and the second oxidesemiconductor layer 158 that are i-type or substantially i-type areincluded between the source electrode layer 112 a and the first region156 a and between the drain electrode layer 112 b and the first region156 a, the transistor can perform on/off operations reliably.Furthermore, the transistor can be normally off.

The structures, the methods, and the like described in this embodimentcan be combined as appropriate with any of the structures, the methods,and the like described in the other embodiments.

Embodiment 3

In this embodiment, an example of an oxide semiconductor layerapplicable to the transistors of Embodiment 1 or 2 will be described.

<Crystallinity of Oxide Semiconductor Layer>

The oxide semiconductor layer is classified roughly into a singlecrystal oxide semiconductor layer and a non-single-crystal oxidesemiconductor layer. As examples of the non-single-crystal oxidesemiconductor layer, an amorphous oxide semiconductor film, a c-axisaligned crystalline oxide semiconductor (CAAC-OS) film, apolycrystalline oxide semiconductor film, a microcrystalline oxidesemiconductor film, and the like can be given.

For example, the first oxide semiconductor layer or the second oxidesemiconductor layer in the transistor may include a CAAC-OS film. TheCAAC-OS film is one of oxide semiconductor films including a pluralityof crystal parts, and most of the crystal parts each fit inside a cubewhose one side is less than 100 nm. Thus, there is a case where acrystal part included in the CAAC-OS film fits inside a cube whose oneside is less than 10 nm, less than 5 nm, or less than 3 nm. The densityof defect states of the CAAC-OS film is lower than that of themicrocrystalline oxide semiconductor film.

In a transmission electron microscope (TEM) image of the CAAC-OS film, aboundary between crystal parts, that is, a grain boundary is not clearlyobserved. Thus, in the CAAC-OS film, a reduction in electron mobilitydue to a grain boundary is less likely to occur.

According to the TEM image of the CAAC-OS film observed in a directionsubstantially parallel to a sample surface (cross-sectional TEM image),metal atoms are arranged in a layered manner in the crystal parts. Eachmetal atom layer has a morphology reflected by a surface over which theCAAC-OS film is formed (hereinafter, a surface over which the CAAC-OSfilm is formed is referred to as a formation surface) or a top surfaceof the CAAC-OS film, and is arranged in parallel to the formationsurface or the top surface of the CAAC-OS film.

On the other hand, according to the TEM image of the CAAC-OS filmobserved in a direction substantially perpendicular to the samplesurface (plan TEM image), metal atoms are arranged in a triangular orhexagonal configuration in the crystal parts. However, there is noregularity of arrangement of metal atoms between different crystalparts.

From the results of the cross-sectional TEM image and the plan TEMimage, alignment is found in the crystal parts in the CAAC-OS film.

In the structural analysis of the CAAC-OS film with an X-ray diffraction(XRD) apparatus, a peak appears at a diffraction angle (2θ) of around31° in some cases when the CAAC-OS film including an InGaZnO₄ crystal isanalyzed by an out-of-plane method, for example. This peak is derivedfrom the (009) plane of the InGaZnO₄ crystal, which indicates thatcrystals in the CAAC-OS film have c-axis alignment, and that the c-axesare aligned in a direction substantially perpendicular to the formationsurface or the top surface of the CAAC-OS film.

On the other hand, when the CAAC-OS film is analyzed by an in-planemethod in which an X-ray enters a sample in a direction substantiallyperpendicular to the c-axis, a peak appears at 2θ of around 56° in somecases. This peak is derived from the (110) plane of the InGaZnO₄crystal. Six peaks are observed in an analysis (φ scan) ofsingle-crystal oxide semiconductor film of InGaZnO₄, under theconditions where the sample is rotated about a normal vector of a samplesurface as an axis (φ axis) with 2θ fixed at around 56°. The six peaksare derived from crystal planes equivalent to the (110) plane. On theother hand, in the case of a CAAC-OS film, a peak is not clearlyobserved even when φ scan is performed with 2θ fixed at around 56°.

According to the above results, in the CAAC-OS film, while thedirections of a-axes and b-axes are different between crystal parts, thec-axes are aligned in a direction parallel to a normal vector of aformation surface or a normal vector of a top surface. Thus, each metalatom layer arranged in a layered manner observed in the cross-sectionalTEM image corresponds to a plane parallel to the a-b plane of thecrystal. Note that in this specification and claims, a simple term“perpendicular” includes a range from 80° to 100°, for example, from 85°to 95°. In addition, the term “parallel” includes a range from −10° to10°, for example, from −5° to 5°.

An electron diffraction pattern of the CAAC-OS film gives spots in somecases. An electron diffraction pattern obtained with an electron beamhaving a diameter of 10 nmφ or smaller, or 5 nmφ or smaller is called ananobeam electron diffraction pattern. FIG. 13A is an example of ananobeam electron diffraction pattern of a sample including the CAAC-OSfilm. Here, the sample is cut in the direction perpendicular to aformation surface of the CAAC-OS film and the thickness thereof isreduced to about 40 nm. Further, an electron beam with a diameter of 1nmφ is applied from the direction perpendicular to the cut surface ofthe sample. As shown in FIG. 13A, spots are observed in the nanobeamelectron diffraction pattern of the CAAC-OS film.

The CAAC-OS film can be obtained by reducing the impurity concentrationin some cases. The impurity means here an element other than the maincomponents of the oxide semiconductor, such as hydrogen, carbon,silicon, or a transition metal element. In particular, the bond strengthof an element such as silicon with oxygen is higher than that of a metalelement included in the oxide semiconductor. Therefore, when the elementabstracts oxygen in the oxide semiconductor, the atomic arrangement inthe oxide semiconductor is disordered, whereby the crystallinity of theoxide semiconductor is lowered in some cases. In addition, a heavy metalsuch as iron or nickel, argon, carbon dioxide, or the like has a largeatomic radius (or molecular radius), and thus disorders the atomicarrangement in the oxide semiconductor, whereby the crystallinity of theoxide semiconductor is lowered in some cases. Hence, the CAAC-OS isregarded as an oxide semiconductor with a low impurity concentration.

The state in which impurity concentration is low and density of defectstates is low (the number of oxygen vacancies is small) is referred toas a “highly purified intrinsic” state or a “substantially highlypurified intrinsic” state. A highly purified intrinsic or substantiallyhighly purified intrinsic oxide semiconductor has few carrier generationsources, and thus has a low carrier density. Thus, a transistorincluding the oxide semiconductor in a channel formation region rarelyhas a negative threshold voltage (is rarely normally-on). A highlypurified intrinsic or substantially highly purified intrinsic oxidesemiconductor is able to have a low density of defect states andaccordingly has low density of trap states. Thus, the transistorincluding the oxide semiconductor in the channel formation region iscapable of having small variations in electrical characteristics andhigh reliability. In contrast, the impurity included in the oxidesemiconductor readily serves as a carrier source and gives a trap level.Additionally, a charge trapped by the trap states in the oxidesemiconductor requires a long time to disappear. The trapped charge maybehave like a fixed charge. Thus, the transistor that includes the oxidesemiconductor having a high density of trap states in the channelformation region readily has unstable electrical characteristics.

The crystal part is formed concurrently with deposition of the CAAC-OSfilm or is formed through crystallization treatment such as heattreatment. As described above, the c-axis of the crystal is aligned in adirection parallel to a normal vector of a formation surface or a normalvector of a top surface of the CAAC-OS film. Thus, for example, in thecase where the shape of the CAAC-OS film is changed by etching or thelike, the c-axis might not be necessarily parallel to a normal vector ofa formation surface or a normal vector of a top surface of the CAAC-OSfilm.

The degree of crystallinity in the CAAC-OS film is not necessarilyuniform. For example, in the case where crystal growth to the CAAC-OSfilm occurs from the vicinity of the top surface of the film, the degreeof the crystallinity in the vicinity of the top surface is higher thanthat in the vicinity of the formation surface in some cases. When animpurity is added to the CAAC-OS film, the crystallinity in a region towhich the impurity is added is changed, and the degree of crystallinityin the CAAC-OS film may vary depending on regions.

When the CAAC-OS film with an InGaZnO₄ crystal is analyzed by anout-of-plane method, a peak of 2θ may also be observed at around 36°, inaddition to at around 31°. The peak of 2θ at around 36° indicates that acrystal having no c-axis alignment is included in part of the CAAC-OSfilm. It is preferable that in the CAAC-OS film, a peak of 2θ appears ataround 31° and does not appear at around 36°.

The CAAC-OS film can also be formed by reducing the density of defectstates for example. As mentioned above, oxygen vacancies in an oxidesemiconductor are defect states and serve as trap levels or as carriersources when hydrogen is trapped therein. In order to form the CAAC-OSfilm, it is important to prevent generation of oxygen vacancies in theoxide semiconductor. Thus, the CAAC-OS film is an oxide semiconductorfilm having a low density of defect states. In other words, the CAAC-OSfilm is an oxide semiconductor film having few oxygen vacancies.

With the use of the highly purified intrinsic or substantially highlypurified intrinsic CAAC-OS film in a transistor, variations in theelectrical characteristics of the transistor due to irradiation withvisible light or ultraviolet light are small. Thus, the transistor hashigh reliability.

The CAAC-OS film can be formed by a sputtering method using a DC powersource, for example.

The first oxide semiconductor layer or the second oxide semiconductorlayer used in the transistor may be a polycrystalline oxidesemiconductor film including a plurality of crystal grains. A crystalgrain with a grain size of equal to 2 nm and less than or equal to 300nm, greater than or equal to 3 nm and less than or equal to 100 nm, orgreater than or equal to 5 nm and less than or equal to 50 nm isfrequently observed in a TEM image of the polycrystalline oxidesemiconductor film. In the TEM image, a boundary between crystal grainscan be found in the polycrystalline oxide semiconductor film in somecases.

The plurality of crystal grains of the polycrystalline oxidesemiconductor film may be different in crystal orientation therebetween.When a polycrystalline oxide semiconductor film is analyzed by anout-of-plane method with use of an XRD apparatus, a plurality oforientation peaks including a peak at 2θ of around 31° appear in somecases. Further, spots are observed in a nanobeam electron diffractionpattern of the polycrystalline oxide semiconductor film in some cases.

The polycrystalline oxide semiconductor film has high crystallinity andthus is possible to provide high electron mobility. Accordingly, atransistor using the polycrystalline oxide semiconductor film for achannel formation region has high field-effect mobility. Note that, inthe case where an impurity is segregated at the grain boundary in thepolycrystalline oxide semiconductor film, the grain boundary may serveas a defect state, a trap state, or a carrier generation source. Hence,a transistor using the polycrystalline oxide semiconductor film for achannel formation region has larger variations in electricalcharacteristics and lower reliability than a transistor using a CAAC-OSfilm for a channel formation region in some cases.

The polycrystalline oxide semiconductor film can be formed byhigh-temperature heat treatment or laser light treatment.

The first oxide semiconductor layer or the second oxide semiconductorlayer used in the transistor may be a microcrystalline oxidesemiconductor film. In the TEM image of the microcrystalline oxidesemiconductor film, crystal parts cannot be usually found clearly. Themicrocrystalline oxide semiconductor film includes a microcrystal (alsoreferred to as nanocrystal) with a size greater than or equal to 1 nmand less than 10 nm, for example. Thus, the microcrystalline oxidesemiconductor film has a higher degree of atomic order, that is, a lowerdensity of defect states than the amorphous oxide semiconductor film.Similarly, in the TEM image of the microcrystalline oxide semiconductorfilm, a boundary between crystal parts cannot be usually found clearly.Accordingly, in the microcrystalline oxide semiconductor film,segregation of impurities is less likely to occur, that is, the densityof defect states is unlikely to be high. In addition, a reduction inelectron mobility is small.

FIG. 13B shows an example of a nanobeam electron diffraction pattern ofa sample including a microcrystalline oxide semiconductor film. Here, asample of the microcrystalline oxide semiconductor film is cut in thedirection perpendicular to a surface on which the microcrystalline oxidesemiconductor film is formed, and the thickness thereof is reduced toabout 40 nm. An electron beam with a diameter of 1 nmφ is emitted fromthe direction perpendicular to the cut surface of the sample. In thenanobeam electron diffraction pattern of the microcrystalline oxidesemiconductor film in FIG. 13B, a plurality of circumferentiallydistributed spots are observed.

Since the microscopic region in the microcrystalline oxide semiconductorfilm has a periodic atomic order, the microcrystalline oxidesemiconductor film has lower density of defect states than the amorphousoxide semiconductor. Note that since crystal parts in themicrocrystalline oxide semiconductor film are not regularly arranged,the microcrystalline oxide semiconductor film has higher density ofdefect states than the CAAC-OS film.

Accordingly, the microcrystalline oxide semiconductor film has a highercarrier density than the CAAC-OS film, in some cases. Since an oxidesemiconductor with high carrier density tends to have high electronmobility, a transistor including the microcrystalline oxidesemiconductor film for a channel formation region tends to have a highfield-effect mobility. Further, since the microcrystalline oxidesemiconductor film has higher density of defect states than the CAAC-OSfilm, the microcrystalline oxide semiconductor film tends to have higherdensity of trap states. Accordingly, a transistor using themicrocrystalline oxide semiconductor film for a channel formation regionusually has larger variations in electrical characteristics and lowerreliability than those of a transistor using the CAAC-OS film for achannel formation region. The microcrystalline oxide semiconductor filmcan be formed easily as compared to the CAAC-OS film because themicrocrystalline oxide semiconductor film can be formed even when arelatively large amount of impurities are included; thus, depending onthe purpose, the microcrystalline oxide semiconductor film can befavorably used. For example, the microcrystalline oxide semiconductorfilm may be formed by a deposition method such as a sputtering methodusing an AC power source. In this case, since the sputtering methodusing an AC power source allows a film to be formed with high uniformityover a large substrate, a semiconductor device including a transistorusing the microcrystalline oxide semiconductor film for a channelformation region can be manufactured with high productivity.

The first oxide semiconductor layer or the second oxide semiconductorlayer used in the transistor may be an amorphous oxide semiconductorfilm, for example. The amorphous oxide semiconductor film has disorderedatomic arrangement and includes no crystalline component. A typicalamorphous oxide semiconductor film exists in an amorphous state in thewhole area. In the TEM image of the amorphous oxide semiconductor film,crystal parts cannot be found.

When the amorphous oxide semiconductor film is subjected to the analysisby an out-of-plane method with an XRD apparatus, a peak that provescrystal orientation does not appear. Further, a halo pattern is observedin the electron diffraction pattern or the nanobeam electron diffractionpattern of the amorphous oxide semiconductor film.

The amorphous oxide semiconductor film can be formed, for example, byintroducing a high-concentration impurity such as hydrogen. Hence, theamorphous oxide semiconductor film is recognized as an oxidesemiconductor film containing a high-concentration impurity.

When an oxide semiconductor layer contains a high-concentrationimpurity, a defect state such as an oxygen vacancy is formed in theoxide semiconductor layer. This means that an amorphous oxidesemiconductor film with a high-concentration impurity has a high densityof defect states. Since the amorphous oxide semiconductor film has lowcrystallinity, the density of defect states of the amorphous oxidesemiconductor film is higher than those of the CAAC-OS film and themicrocrystalline oxide semiconductor film.

Accordingly, the amorphous oxide semiconductor film has higher carrierdensity than the microcrystalline oxide semiconductor film. Therefore, atransistor using the amorphous oxide semiconductor film for a channelformation region tends to be normally on, and the amorphous oxidesemiconductor film can preferably be used for a transistor which needsto have normally on electrical characteristics. The amorphous oxidesemiconductor film has a high density of defect states and thus tends tohave a high density of trap states. Therefore, a transistor using theamorphous oxide semiconductor for a channel formation region has largervariations in electrical characteristics and lower reliability thanthose of a transistor using the CAAC-OS film or the microcrystallineoxide semiconductor film for a channel formation region. Note that theamorphous oxide semiconductor film can be formed by a deposition methodthat causes a relatively large amount of impurity to be contained in thedeposited film, and thus can be easily obtained and preferably useddepending on the use. For example, the amorphous oxide semiconductorfilm may be formed by a deposition method such as a spin coating method,a sol-gel method, an immersion method, a spray method, a screen printingmethod, a contact printing method, an ink-jet printing method, a rollcoating method, or a mist CVD method. Hence, a semiconductor deviceincluding a transistor using the amorphous oxide semiconductor film fora channel formation region can be manufactured with high productivity.

Note that the oxide semiconductor layer may be a mixed film includingtwo or more of the CAAC-OS film, the polycrystalline oxide semiconductorfilm, the microcrystalline oxide semiconductor film, and the amorphousoxide semiconductor film. For example, the mixed film includes two ormore of an amorphous oxide semiconductor region, a microcrystallineoxide semiconductor region, a polycrystalline oxide semiconductorregion, and a CAAC-OS region. Further for example, the mixed film has astacked-layer structure of two or more of an amorphous oxidesemiconductor region, a microcrystalline oxide semiconductor region, apolycrystalline oxide semiconductor region, and a CAAC-OS region.

The first oxide semiconductor layer or the second oxide semiconductorlayer used in the transistor may be a single crystal oxide semiconductorfilm. The single crystal oxide semiconductor film has a low impurityconcentration and a low density of defect states (a small number ofoxygen vacancies), and thus has a low carrier density. Therefore, atransistor using the single crystal oxide semiconductor film for achannel formation region is unlikely to be normally on. Further, thesingle crystal oxide semiconductor film has a low density of defectstates and thus has a low density of trap states. Therefore, atransistor using the single crystal oxide semiconductor film for achannel formation region has small variations in electricalcharacteristics and a high reliability.

The density of the oxide semiconductor layer becomes higher as thequantity of defects in the layer is smaller or as the crystallinity ofthe layer is higher. In addition, as the oxide semiconductor layer has alower concentration of impurities such as hydrogen, the density of thelayer is increased. Usually, the density of a single crystal oxidesemiconductor film is higher than that of a CAAC-OS film, the density ofa CAAC-OS film is higher than that of a microcrystalline oxidesemiconductor film, the density of a polycrystalline oxide semiconductorfilm is higher than that of a microcrystalline oxide semiconductor film,and the density of a microcrystalline oxide semiconductor film is higherthan that of an amorphous oxide semiconductor film.

Although the crystallinity of the oxide semiconductor layer(specifically, the first oxide semiconductor layer or the second oxidesemiconductor layer included in the oxide stack) has been described indetail here, since the first oxide layer and the second oxide layerprovided over and under the oxide semiconductor layer are oxide layersincluding the same main components as the oxide semiconductor layer inthe semiconductor device of one embodiment of the present invention, thefirst oxide layer and the second oxide layer may include a CAAC-OS film,a polycrystalline oxide semiconductor film, a microcrystalline oxidesemiconductor film, an amorphous oxide semiconductor film, or a singlecrystal oxide semiconductor film, or a mixed film including two or morekinds of these crystal states, as in the oxide semiconductor layer.

<Formation Method of the CAAC-OS Film>

For example, the CAAC-OS film is formed by a sputtering method with apolycrystalline oxide semiconductor sputtering target. When ions collidewith the sputtering target, a crystal region included in the sputteringtarget may be separated from the target along an a-b plane; in otherwords, a sputtered particle having a plane parallel to an a-b plane(flat-plate-like sputtered particle or pellet-like sputtered particle)may flake off from the sputtering target. In that case, theflat-plate-like sputtered particle reaches a substrate while maintainingtheir crystal state, whereby the CAAC-OS film can be formed.

The flat-plate-like sputtered particle has, for example, an equivalentcircle diameter of a plane parallel to the a-b plane of greater than orequal to 3 nm and less than or equal to 10 nm, and a thickness (lengthin the direction perpendicular to the a-b plane) of greater than orequal to 0.7 nm and less than 1 nm. Note that in the flat-plate-likesputtered particle, the plane parallel to the a-b plane may be a regulartriangle or a regular hexagon. Here, the term “equivalent circlediameter of a plane” refers to the diameter of a perfect circle havingthe same area as the plane.

For the deposition of the CAAC-OS film, the following conditions arepreferably used.

One of the conditions is increased temperature of the substrate.Specifically, the substrate temperature during the deposition is kept ata temperature higher than or equal to 100° C. and lower than or equal to740° C., preferably higher than or equal to 200° C. and lower than orequal to 500° C. Increase in the substrate temperature during thedeposition provides a following plausible mechanism for the formation ofthe CAAC-OS film. Specifically, when the flat-plate-like sputteredparticles reach the substrate, migration occurs on the substratesurface, so that a flat plane of the sputtered particles is attached tothe substrate. At this time, the sputtered particle is chargedpositively, whereby sputtered particles are attached to the substratewhile repelling each other; thus, the sputtered particles do not overlapwith each other randomly, and a CAAC-OS film with a uniform thicknesscan be deposited.

Second, the amount of impurities entering the CAAC-OS layer during thedeposition is reduced, by which the crystal state can be prevented frombeing broken by the impurities. For example, the concentration ofimpurities (e.g., hydrogen, water, carbon dioxide, or nitrogen) whichexist in the deposition chamber may be reduced. Furthermore, theconcentration of impurities in a deposition gas may be reduced.Specifically, a deposition gas whose dew point is −80° C. or lower,preferably −100° C. or lower is used.

Finally, the proportion of oxygen in the deposition gas is increased andthe power is optimized, which allows the reduction of the plasma damageat the deposition. The proportion of oxygen in the deposition gas ishigher than or equal to 30 vol %, preferably 100 vol %.

Alternatively, the CAAC-OS film is formed by the following method.

First, a first oxide semiconductor film is formed to a thickness ofgreater than or equal to 1 nm and less than 10 nm. The first oxidesemiconductor film is formed by a sputtering method. Specifically, thesubstrate temperature is set to higher than or equal to 100° C. andlower than or equal to 500° C., preferably higher than or equal to 150°C. and lower than or equal to 450° C., and the proportion of oxygen in adeposition gas is set to higher than or equal to 30 vol %, preferably100 vol %.

Next, heat treatment is performed so that the first oxide semiconductorfilm becomes a first CAAC-OS film with high crystallinity. Thetemperature of the heat treatment is higher than or equal to 350° C. andlower than or equal to 740° C., preferably higher than or equal to 450°C. and lower than or equal to 650° C. The heat treatment time is longerthan or equal to 1 minute and shorter than or equal to 24 hours,preferably longer than or equal to 6 minutes and shorter than or equalto 4 hours. The heat treatment may be performed in an inert atmosphereor an oxidation atmosphere. It is preferable to perform heat treatmentin an inert atmosphere and then perform heat treatment in an oxidationatmosphere. The heat treatment in an inert atmosphere can reduce theconcentration of impurities in the first oxide semiconductor film for ashort time. At the same time, the heat treatment in an inert atmospheremay generate oxygen vacancies in the first oxide semiconductor film. Insuch a case, the oxygen vacancies can be reduced by heat treatment in anoxidation atmosphere. Note that the heat treatment may be performedunder a reduced pressure, such as 1000 Pa or lower, 100 Pa or lower, 10Pa or lower, or 1 Pa or lower. The heat treatment under the reducedpressure can reduce the concentration of impurities in the first oxidesemiconductor film for a shorter time.

The first oxide semiconductor film can be crystallized easier in thecase where the thickness is greater than or equal to 1 nm and less than10 nm than in the case where the thickness is greater than or equal to10 nm.

Next, a second oxide semiconductor film having the same composition asthe first oxide semiconductor film is formed to a thickness of greaterthan or equal to 10 nm and less than or equal to 50 nm. The second oxidesemiconductor film is formed by a sputtering method. Specifically, thesubstrate temperature is set to higher than or equal to 100° C. andlower than or equal to 500° C., preferably higher than or equal to 150°C. and lower than or equal to 450° C., and the proportion of oxygen in adeposition gas is set to higher than or equal to 30 vol %, preferably100 vol %.

Next, heat treatment is performed so that solid phase growth of thesecond oxide semiconductor film is performed using the first CAAC-OSfilm, thereby forming a second CAAC-OS film with high crystallinity. Thetemperature of the heat treatment is higher than or equal to 350° C. andlower than or equal to 740° C., preferably higher than or equal to 450°C. and lower than or equal to 650° C. The heat treatment time is longerthan or equal to 1 minute and shorter than or equal to 24 hours,preferably longer than or equal to 6 minutes and shorter than or equalto 4 hours. The heat treatment may be performed in an inert atmosphereor an oxidation atmosphere. It is preferable to perform heat treatmentin an inert atmosphere and then perform heat treatment in an oxidationatmosphere. The heat treatment in an inert atmosphere can reduce theconcentration of impurities in the second oxide semiconductor film for ashort time. At the same time, the heat treatment in an inert atmospheremay generate oxygen vacancies in the second oxide semiconductor film. Insuch a case, the oxygen vacancies can be reduced by the heat treatmentin an oxidation atmosphere. Note that the heat treatment may beperformed under a reduced pressure, such as 1000 Pa or lower, 100 Pa orlower, 10 Pa or lower, or 1 Pa or lower. The heat treatment under thereduced pressure can reduce the concentration of impurities in thesecond oxide semiconductor film for a shorter time.

As described above, a CAAC-OS film with a total thickness of greaterthan or equal to 10 nm can be formed. The CAAC-OS film can be favorablyused as the oxide semiconductor layer in the oxide stack.

Next, a formation method of an oxide film when the temperature of adeposition surface is low is described (for example, the temperature islower than 130° C., lower than 100° C., lower than 70° C. or at roomtemperatures (20° C. to 25° C.)).

When the deposition surface has a low temperature, the sputteredparticle flutters down on the deposition surface randomly. The sputteredparticle does not migrate and thus is deposited at random in areasincluding an area where another sputtered particle 1002 is deposited,for example. In other words, the thickness of the deposited oxide layeris not uniform and the orientation of crystals is irregular. The oxidefilm deposited in this manner has a crystal part (nanocrystal) becausethe crystallinity of the sputtered particle is maintained to somedegree.

In addition, when the pressure during deposition is high, the sputteredparticle that is released collides with another particle (includingatom, molecule, ion, radical, or the like) of argon or the like inhigher frequency. The crystal structure of the sputtered particle may bebroken when the sputtered particle that is released collides withanother particle (the sputtered particle is re-sputtered). For example,when the sputtered particle collides with another particle, theflat-plate shape of the sputtered particle may not be able to bemaintained to be broken into fragments (separated into atoms) in somecases. At this time, each atom separated from the sputtered particle isdeposited on the deposition surface so that an amorphous oxide film isformed in some cases.

In addition, when a process in which a solid target is vaporized isemployed instead of a sputtering method using a target having apolycrystalline oxide, the released particles are separated into atomsand are deposited on a deposition surface and thus an amorphous oxidefilm is formed in some cases. In addition, in a laser ablation method,atoms, molecules, ions, radicals, clusters, or the like released from atarget are deposited on the deposition surface so that an amorphousoxide film is likely to be formed.

An oxide layer or an oxide semiconductor layer in any of the abovecrystal states may be used for the first oxide layer, the first oxidesemiconductor layer, the second oxide semiconductor layer, and thesecond oxide layer the transistor of one embodiment of the presentinvention. However, it is preferable to use a CAAC-OS film as the oxidesemiconductor layer functioning as a channel.

In the case of using the CAAC-OS film as the second oxide semiconductorlayer, the second oxide layer provided over and in contact with thesecond oxide semiconductor layer tends to have a crystal structure thatis grown using a crystal of the second oxide semiconductor layer as aseed crystal. Accordingly, even when the first oxide layer and thesecond oxide layer are formed using the same material and the samemanufacturing method, the second oxide layer might have a highercrystallinity than the first oxide layer. Further, a region in contactwith the second oxide semiconductor layer and a region that is not incontact with the second oxide semiconductor layer in the second oxidelayer might have different crystallinities.

The structures, the methods, and the like described in this embodimentcan be combined as appropriate with any of the structures, the methods,and the like described in the other embodiments.

Embodiment 4

In this embodiment, configuration examples of power converter circuitssuch as an inverter and an converter each including the transistordescribed in the above embodiment are described as an example of asemiconductor device that is one embodiment of the present invention.

[DC-DC Converter]

A DC-DC converter 501 in FIG. 14A is an example of a power converter andis a step-down DC-DC converter using a chopper circuit. The DC-DCconverter 501 includes a capacitor 502, a transistor 503, a controlcircuit 504, a diode 505, a coil 506, and a capacitor 507.

The DC-DC converter 501 is operated by a switching operation of thetransistor 503 with the control circuit 504. By the DC-DC converter 501,an input voltage V1 applied to input terminals IN1 and IN2 can be outputfrom output terminals OUT1 and OUT2 to a load 508 as a voltage V2 whichis stepped down. The semiconductor device described in any of the aboveembodiments can be applied to the transistor 503 included in the DC-DCconverter 501. Therefore, a large amount of output current can flowthrough the DC-DC converter 501 by the switching operation, andoff-state current can be reduced. Therefore, the DC-DC converterconsumes less power and can operate at high speed.

Although the step-down DC-DC converter using a chopper circuit isillustrated in FIG. 14A as an example of a non-isolated power convertercircuit, the semiconductor device described in any of the aboveembodiments can also be applied to a transistor included in a step-upDC-DC converter using a chopper circuit or a step-up/step-down DC-DCconverter using a chopper circuit. Therefore, a large amount of outputcurrent can flow through the DC-DC converter by the switching operation,and off-state current can be reduced. Therefore, the DC-DC converterconsumes less power and can operate at high speed.

Next, a DC-DC converter 511 is illustrated in FIG. 14B as an example ofa power converter, and an example of a circuit structure of a fly-backconverter that is an isolated power converter circuit is shown here. TheDC-DC converter 511 includes a capacitor 512, a transistor 513, acontrol circuit 514, a transformer 515 including a primary coil and asecondary coil, a diode 516, and a capacitor 517.

The DC-DC converter 511 in FIG. 14B is operated by a switching operationof the transistor 513 with the control circuit 514. By the DC-DCconverter 511, an input voltage V1 applied to input terminals IN1 andIN2 can be output from output terminals OUT1 and OUT2 to a load 518 as avoltage V2 that is stepped up or stepped down. The semiconductor devicedescribed in any of the above embodiments can be applied to thetransistor 513 included in the DC-DC converter 511. Therefore, a largeamount of output current can flow through the DC-DC converter 511 by theswitching operation, and off-state current can be reduced. Therefore,the DC-DC converter consumes less power and can operate at high speed.

Note that the semiconductor device described in any of the aboveembodiments can also be applied to a transistor included in a forwardDC-DC converter.

An inverter 601 in FIG. 15 is an example of a full-bridge inverter. Theinverter 601 includes a transistor 602, a transistor 603, a transistor604, a transistor 605, and a control circuit 606.

The inverter 601 in FIG. 15 is operated by a switching operation of thetransistors 602 to 605 with the control circuit 606. A direct-currentvoltage V1 applied to input terminals IN1 and IN2 can be output fromoutput terminals OUT1 and OUT2 as an alternating-current voltage V2. Thesemiconductor device described in any of the above embodiments can beused for the transistors 602 to 605 included in the inverter 601.Therefore, a large amount of output current can flow through theinverter 601 by the switching operation, and off-state current can bereduced. Therefore, the inverter consumes less power and can operate athigh speed.

The structures, the methods, and the like described in this embodimentcan be combined as appropriate with any of the structures, the methods,and the like described in the other embodiments.

Embodiment 5

In this embodiment, a configuration example of a power supply circuitincluding the transistor described in any of the above embodiments isdescribed as an example of a semiconductor device of one embodiment ofthe present invention.

FIG. 16 illustrates a configuration example of a power supply circuit400 of one embodiment of the present invention. The power supply circuit400 in FIG. 16 includes a control circuit 413, a power switch 401, apower switch 402, and a voltage regulator 403.

Voltage is supplied from a power supply 416 to the power supply circuit400. The power switches 401 and 402 each have a function of controllinginput of the voltage to the voltage regulator 403.

Note that in the case where the voltage output from the power supply 416is AC voltage, as illustrated in FIG. 16, the power switch 401controlling input of a first potential to the voltage regulator 403 andthe power switch 402 controlling input of a second potential to thevoltage regulator 403 are provided in the power supply circuit 400. Inthe case where the voltage output from the power supply 416 is DCvoltage, as illustrated in FIG. 16, the power switch 401 and the powerswitch 402 may be provided in the power supply circuit 400;alternatively, the second potential may be set to a ground potential,the power switch 402 is not provided, and the power switch 401 may beprovided in the power supply circuit 400 instead.

In one embodiment of the present invention, a transistor having highwithstand voltage is used as each of the power switches 401 and 402. Forexample, the transistor described in Embodiment 1 or Embodiment 2 can beused for the transistor.

When the transistors having the oxide stack are used for the powerswitches 401 and 402, high output current can flow through the powerswitches 401 and 402 and the power switches 401 and 402 can have highwithstand voltage.

The use of a transistor including the oxide semiconductor in accordancewith one embodiment in an active layer for the power switch 401 or 402can achieve high-speed switching of the power switch 401 or 402,compared with a transistor including silicon carbide or gallium nitridein an active layer. Consequently, power loss due to the switching can bereduced.

The voltage regulator 403 has a function of regulating voltage inputfrom the power supply 416 through the power switches 401 and 402.Specifically, voltage regulation in the voltage regulator 403 means anyone or more of conversion of AC voltage into DC voltage, change of avoltage level, smoothing of a voltage level, and the like.

Voltage regulated in the voltage regulator 403 is applied to a load 417and the control circuit 413.

The power supply circuit 400 in FIG. 16 includes a power storage device404, an auxiliary power supply 405, a voltage generation circuit 406,transistors 407 to 410, and capacitors 414 and 415.

The power storage device 404 has a function of temporarily storing powersupplied from the voltage regulator 403. Specifically, the power storagedevice 404 includes a power storage portion such as a capacitor or asecondary battery that can store power with the use of voltage appliedfrom the voltage regulator 403.

The auxiliary power supply 405 has a function of compensating for thelack of power output from the power storage device 404 for operation ofthe control circuit 413. A primary battery or the like can be used asthe auxiliary power supply 405.

The voltage generation circuit 406 has a function of generating voltagefor controlling switching of the power switches 401 and 402 with the useof voltage output from the power storage device 404 or the auxiliarypower supply 405. Specifically, the voltage generation circuit 406 has afunction of generating voltage for turning on the power switches 401 and402 and a function of generating voltage for turning off the powerswitches 401 and 402.

A wireless signal input circuit 411 has a function of controlling thepower switches 401 and 402 in accordance with switching of thetransistors 407 to 410.

Specifically, the wireless signal input circuit 411 includes an inputportion that converts an instruction superimposed on a wireless signalgiven from the outside to control the operating states of the powerswitches 401 and 402 into an electric signal, and a signal processorthat decodes the instruction included in the electric signal andgenerates a signal for controlling the switching of the transistors 407to 410 in accordance with the instruction.

The transistors 407 to 410 switch in accordance with the signalgenerated in the wireless signal input circuit 411. Specifically, whenthe transistors 408 and 410 are on, the voltage for turning on the powerswitches 401 and 402 that is generated in the voltage generation circuit406 is applied to the power switches 401 and 402. When the transistors408 and 410 are turned off in this state, the voltage for turning on thepower switches 401 and 402 is continuously applied to the power switches401 and 402. Further, when the transistors 407 and 409 are sequentiallyturned on, the voltage for turning off the power switches 401 and 402that is generated in the voltage generation circuit 406 is applied tothe power switches 401 and 402. When the transistors 407 and 409 areturned off in this state, the voltage for turning off the power switches401 and 402 is continuously applied to the power switches 401 and 402.

In one embodiment of the present invention, a transistor with extremelylow off-state current is used as each of the transistors 407 to 410 sothat the operating states provided to the power switches 401 and 402 aremaintained. With this structure, even when generation of the voltage fordetermining the operating states of the power switches 401 and 402 inthe voltage generation circuit 406 is stopped, the operating states ofthe power switches 401 and 402 can be kept. Thus, the power consumptionof the voltage generation circuit 406 is reduced, so that the powerconsumption of the power supply circuit 400 can be reduced.

Note that the transistors 407 to 410 may be provided with back gates andthe back gates are supplied with a potential in order to control thethreshold voltages of the transistors 407 to 410.

Since a transistor including the oxide semiconductor of a wide-gapsemiconductor whose band gap is two or more times that of silicon in anactive layer has extremely low off-state current, the transistor ispreferably used as each of the transistors 407 to 410.

Among the oxide semiconductors, unlike silicon carbide or galliumnitride, an In—Ga—Zn-based oxide, an In—Sn—Zn-based oxide, or the likehas an advantage of high mass productivity because a transistor withfavorable electrical characteristics can be formed by sputtering or awet process. Further, unlike silicon carbide or gallium nitride, theIn—Ga—Zn-based oxide can be deposited even at room temperature; thus, atransistor with favorable electrical characteristics can be formed overa glass substrate or an integrated circuit using silicon. Further, alarger substrate can be used.

The capacitor 414 has a function of holding voltage applied to the powerswitch 401 when the transistors 407 and 408 are off. The capacitor 415has a function of holding voltage applied to the power switch 402 whenthe transistors 409 and 410 are off. One of a pair of electrodes of eachof the capacitors 414 and 415 is connected to the wireless signal inputcircuit 411. Note that as illustrated in FIG. 17, the capacitors 414 and415 are not necessarily provided.

When the power switches 401 and 402 are on, voltage is supplied from thepower supply 416 to the voltage regulator 403. In addition, with thevoltage, power is stored in the power storage device 404.

When the power switches 401 and 402 are off, supply of voltage from thepower supply 416 to the voltage regulator 403 is stopped. Thus, althoughpower is not supplied to the power storage device 404, the controlcircuit 413 can be operated using power stored in the power storagedevice 404 or the auxiliary power supply 405 in one embodiment of thepresent invention, as described above. In other words, in the powersupply circuit 400 according to one embodiment of the present invention,supply of voltage to the voltage regulator 403 can be stopped while theoperating states of the power switches 401 and 402 are controlled by thecontrol circuit 413. By stopping the supply of voltage to the voltageregulator 403, it is possible to prevent power consumption due tocharging and discharging of the capacitance of the voltage regulator 403when voltage is not supplied to the load 417. Consequently, the powerconsumption of the power supply circuit 400 can be reduced.

The structures, the methods, and the like described in this embodimentcan be combined as appropriate with any of the structures, the methods,and the like described in the other embodiments.

Embodiment 6

A semiconductor device (including a power converter circuit and a powersupply circuit) of one embodiment of the present invention is suitablefor controlling supply of power to a device and favorably usedparticularly for a device that needs large power. For example, thesemiconductor device can be favorably used for a device provided with adriver portion whose driving is controlled with power of a motor or thelike and a device that controls heating or cooling by power,

Electronic appliances in which the semiconductor device of oneembodiment of the present invention can be used are display devices,personal computers, image reproducing devices provided with recordingmedia (typically, devices which reproduce the content of recording mediasuch as digital versatile discs (DVDs) and have displays for displayingthe reproduced images), and the like. Further, as electronic appliancesin which the semiconductor device of one embodiment of the presentinvention can be used, cellular phones, game machines (includingportable game machines), portable information terminals, e-book readers,cameras such as video cameras and digital still cameras, goggle-typedisplays (head mounted displays), navigation systems, audio reproducingdevices (e.g., car audio systems and digital audio players), copiers,facsimiles, printers, multifunction printers, automated teller machines(ATM), vending machines, high-frequency heating apparatuses such asmicrowave ovens, electric rice cookers, electric washing machines,electric fans, driers, air-conditioning systems such as airconditioners, raising and lowering devices such as elevators andescalators, electric refrigerators, electric freezers, electricrefrigerator-freezers, electric sewing machines, electric tools,semiconductor testing devices, and the like can be given. Thesemiconductor device of one embodiment of the present invention may beused for a moving object powered by an electric motor. The moving objectis a motor vehicle (a motorcycle or an ordinary motor vehicle with threeor more wheels), a motor-assisted bicycle including an electric bicycle,an airplane, a vessel, a rail car, or the like. Further, thesemiconductor device can be used for controlling driving of industrialrobots used in a variety of fields, e.g., industries of food, homeelectric appliances, the moving objects, steel, semiconductor devices,civil engineering, architecture, and construction.

Specific examples of these electronic appliances are illustrated inFIGS. 18A to 18D.

FIG. 18A illustrates a microwave oven 1400, which includes a housing1401, a treatment room 1402 where an object is placed, a display portion1403, an input device (e.g., an operating panel) 1404, and anirradiation portion 1405 supplying an electromagnetic wave generatedfrom a high-frequency wave generator provided in the housing 1401 to thetreatment room 1402.

The semiconductor device of one embodiment of the present invention canbe used, for example, in a power supply circuit that controls supply ofpower to the high-frequency wave generator.

FIG. 18B illustrates a washing machine 1410, which includes a housing1411, an open/close portion 1412 for a washing tub provided in thehousing 1411, an input device (e.g., an operating panel) 1413, and awater inlet 1414 of the washing tub.

The semiconductor device of one embodiment of the present invention canbe used, for example, in a circuit that controls supply of power to amotor controlling rotation of the washing tub.

FIG. 18C is an example of an electric refrigerator-freezer. Theelectronic appliance illustrated in FIG. 18C includes a housing 1451, arefrigerator door 1452, and a freezer door 1453.

In the electronic appliance illustrated in FIG. 18C, the semiconductordevice that is one embodiment of the present invention is providedinside the housing 1451. With this structure, supply of a power voltageto the semiconductor device in the housing 1451 can be controlled inaccordance with the temperature inside the housing 1451 or in responseto opening and closing of the refrigerator door 1452 and the freezerdoor 1453, for example.

FIG. 18D illustrates an example of an air conditioner. The electronicappliance illustrated in FIG. 18D includes an indoor unit 1460 and anoutdoor unit 1464.

The indoor unit 1460 includes a housing 1461 and a ventilation duct1462.

In the electronic appliance illustrated in FIG. 18D, the semiconductordevice that is one embodiment of the present invention is providedinside the housing 1461. With this structure, supply of a power supplyvoltage to the semiconductor device in the housing 1461 can becontrolled in response to a signal from a remote controller or inaccordance with the indoor temperature or humidity, for example.

The semiconductor device of one embodiment of the present invention canbe used, for example, in a circuit that controls supply of power to amotor controlling rotation of a fan included in the outdoor unit 1464.

Note that the split-system air conditioner including the indoor unit andthe outdoor unit is shown in FIG. 18D as an example; alternatively, anair conditioner may be such that the functions of an indoor unit and anoutdoor unit are integrated in one housing.

The structures, the methods, and the like described in this embodimentcan be combined as appropriate with any of the structures, the methods,and the like described in the other embodiments.

Example

In this example, the band structure of an oxide stack was examined.

[Energy Gap]

First, samples were formed in such a manner that ions were implanted tooxide semiconductor layers under different conditions, and the energygap in each sample was measured.

[Formation of Sample]

A quartz substrate was used as a substrate of each sample. An oxidesemiconductor layer having a thickness of about 100 nm was depositedover the surface of the substrate. The oxide semiconductor layer wasdeposited by a sputtering method using a polycrystalline sputteringtarget having an atomic ratio of In:Ga:Zn=1:1:1.

Then, phosphorus was implanted to the oxide semiconductor layer by anion implantation method. The following conditions were used for theimplantation of phosphorus: three conditions of the acceleratingvoltage, i.e., 10 kV, 20 kV, and 30 kV were used; and seven conditionsof the dosage of phosphorus, i.e., 1×10¹² cm⁻², 1×10¹³ cm⁻², 1×10¹⁴cm⁻², 5×10¹⁴ cm⁻², 1×10¹⁵ cm⁻², 3×10¹⁵ cm⁻², and 5×10¹⁵ cm⁻² were used.

[Evaluation by Ellipsometry]

The band gap of each of the formed samples was obtained by ellipsometry.Here, as the oxide semiconductor layer, a stacked-layer structure inwhich a first layer (L1) that was not doped with phosphorus and a secondlayer (L2) that was doped with phosphorus were stacked from thesubstrate side is assumed. The relationships between the condition ofion implantation and the thickness of the second layer (L2) are shown ingraphs in the upper section of FIG. 19 and the relationships between thecondition of ion implantation and the band gap of the second layer (L2)are shown in graphs in the lower section of FIG. 19.

A dashed line in each graph in the lower section of FIG. 19 denotes theband gap (3.22 eV) in the sample that is not doped with phosphorus.

The graphs in the upper section of FIG. 19 show that as the acceleratingvoltage is increased and the amount of implanted ions is increased, aregion whose resistance is reduced by the doping with phosphorus tendsto expand in the depth direction.

The graphs in the lower section of FIG. 19 show that as the amount ofimplanted ions is increased, the band gap tends to be reduced. Further,it is found that as the accelerating voltage is reduced, distribution inthe depth direction is reduced, and as a result, the change in band gapwith respect to the amount of implanted ions tends to increase.

[Band Structure]

A sample different from those described above was formed and evaluatedby ultraviolet photoemission spectroscopy (UPS).

[Formation of Sample]

A silicon wafer was used as a substrate of the sample. First, an oxidefilm on the silicon substrate was removed by dilute hydrofluoric acid,and then a first oxide layer having a thickness of about 10 nm and afirst oxide semiconductor layer having a thickness of about 25 nm weresuccessively deposited over the silicon substrate. The first oxide layerwas deposited by a sputtering method using a polycrystalline sputteringtarget having an atomic ratio of In:Ga:Zn=1:3:2. The deposition of thefirst oxide semiconductor layer was performed in a manner similar tothat described above. That is, over the first oxide layer was formed thefirst oxide semiconductor layer by a sputtering method using apolycrystalline sputtering target of In:Ga:Zn=1:1:1 at a thickness ofapproximately 100 nm.

Next, phosphorus was implanted to the first oxide semiconductor layer byan ion implantation method. The conditions of the implantation ofphosphorus were as follows: the accelerating voltage was 10 kV; and thedosage of phosphorus was 1×10¹⁴ cm⁻².

Next, a second oxide semiconductor layer having a thickness of about 10nm and a second oxide layer having a thickness of about 10 nm weresuccessively deposited. The second oxide semiconductor layer wasdeposited in a manner similar to that of the first oxide semiconductorlayer, and the second oxide layer was deposited in a manner similar tothat of the first oxide layer.

[Evaluation Using UPS]

An energy difference between the vacuum level and the top of the valenceband (the energy difference is also referred to as an ionizationpotential) in the formed sample was measured using UPS. In themeasurement, distribution of the ionization potential in the depthdirection was examined while the sample was etched from its surface by asputtering method.

FIG. 20 shows an energy difference (Ev) between the vacuum level and thetop of the valence band versus the sputtering time, which was obtainedby UPS. Dashed lines in FIG. 20 each denote the interface between layersestimated from the value of Ev. The sputtering time corresponds to thethickness of the oxide stack.

Further, FIG. 20 shows an energy difference (Ec) between the vacuumlevel and the bottom of the conduction band, which was calculated usingthe above described Ev and value of the band gap obtained byellipsometry. Here, the band gap of a layer deposited using apolycrystalline sputtering target having an atomic ratio ofIn:Ga:Zn=1:1:1 (the layer is represented as IGZO(111)) was 3.22 eV, andthe band gap of a layer deposited using a polycrystalline sputteringtarget having an atomic ratio of In:Ga:Zn=1:3:2 (the layer isrepresented as IGZO(132)) was 3.50 eV.

As shown in FIG. 20, the energy difference Ev is a substantiallyconstant value (about 8.0 eV) regardless of the doping of phosphorus.

Further, as shown in FIG. 20, IGZO(132) has the smallest energydifference Ec and IGZO(111) has the secondary smallest energy differenceEc, while the IGZO(111) to which phosphorus was implanted has thelargest energy difference Ec. The difference in Ec between IGZO(132) andIGZO(111) was about 0.28 eV, and the difference in Ec between IGZO(111)and IGZO(111) to which phosphorus was implanted was about 0.24 eV.

The above results indicate that the oxide stack of one embodiment of thepresent invention has two-stage well.

This application is based on Japanese Patent Application serial no.2013-037673 filed with Japan Patent Office on Feb. 27, 2013, the entirecontents of which are hereby incorporated by reference.

1. A semiconductor device comprising: a transistor which includes: afirst oxide layer; a first oxide semiconductor layer over and in contactwith the first oxide layer, the first oxide semiconductor layerincluding a first region containing an impurity; a second oxidesemiconductor layer over and in contact with the first region; and asecond oxide layer over and in contact with the second oxidesemiconductor layer, wherein the second oxide layer contains at leastone of metal elements constituting the second oxide semiconductor layer.2. The semiconductor device according to claim 1, wherein the firstoxide layer contains at least one of metal elements constituting thefirst oxide semiconductor layer.
 3. The semiconductor device accordingto claim 1, wherein the first oxide semiconductor layer contains atleast one of metal elements constituting the second oxide semiconductorlayer at different proportions.
 4. The semiconductor device according toclaim 1, wherein the impurity is selected from carbon, phosphorus,arsenic, antimony, boron, aluminum, nitrogen, argon, helium, neon,fluorine, chlorine, hydrogen, and titanium.
 5. A semiconductor devicecomprising: a first oxide layer; a first oxide semiconductor layer overand in contact with the first oxide layer, the first oxide semiconductorlayer including a first region containing an impurity; a second oxidesemiconductor layer over and in contact with the first region; a secondoxide layer over and in contact with the second oxide semiconductorlayer; a source electrode layer and a drain electrode layer over thesecond oxide semiconductor layer; a gate insulating layer over thesecond oxide layer, the source electrode layer, and the drain electrodelayer, the gate insulating layer being in contact with the second oxidelayer; and a gate electrode over the gate insulating layer, wherein thesecond oxide layer is provided between the second oxide semiconductorlayer and at least one of the source electrode layer and the drainelectrode layer.
 6. The semiconductor device according to claim 5,wherein the source electrode layer and the drain electrode layer arelocated over and in contact with the second oxide layer.
 7. Thesemiconductor device according to claim 5, wherein the gate insulatinglayer is in contact with the source electrode layer and the drainelectrode layer.
 8. The semiconductor device according to claim 5,wherein the second oxide layer is covered by the source electrode layerand the drain electrode layer.
 9. The semiconductor device according toclaim 5, wherein a side surface of the first oxide semiconductor layeris fully covered by the second oxide semiconductor layer.
 10. Thesemiconductor device according to claim 5, wherein the first oxidesemiconductor layer is capsuled by the first oxide layer and the secondoxide semiconductor layer.
 11. The semiconductor device according toclaim 5, wherein a side surface of the first oxide layer is fullycovered by the second oxide semiconductor layer.
 12. The semiconductordevice according to claim 5, wherein the second oxide semiconductorlayer is in contact with a top surface of the first oxide layer.
 13. Thesemiconductor device according to claim 5, wherein the first oxidesemiconductor layer and the second oxide semiconductor layer arecapsuled by the first oxide layer and the second oxide layer.
 14. Thesemiconductor device according to claim 5, wherein a side surface of thesecond oxide layer is coplanar with a side surface of the gateinsulating layer.
 15. The semiconductor device according to claim 5,wherein a side surface of the second oxide layer is coplanar with a sidesurface of the gate electrode.
 16. The semiconductor device according toclaim 5, wherein the gate electrode is offset in a channel lengthdirection with respect to the first region.
 17. The semiconductor deviceaccording to claim 5, wherein the first oxide layer contains at leastone of metal elements constituting the first oxide semiconductor layer.18. The semiconductor device according to claim 5, wherein the firstoxide semiconductor layer contains at least one of metal elementsconstituting the second oxide semiconductor layer at differentproportions.
 19. The semiconductor device according to claim 5, whereinthe second oxide layer contains at least one of metal elementsconstituting the second oxide semiconductor layer.
 20. The semiconductordevice according to claim 5, wherein the impurity is selected fromcarbon, phosphorus, arsenic, antimony, boron, aluminum, nitrogen, argon,helium, neon, fluorine, chlorine, hydrogen, and titanium.